Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Qualcomm and IMEC Collaborate on 3D Integration Research

Abstract:
IMEC, Europe's leading independent nanoelectronics research institute, and Qualcomm Incorporated (Nasdaq:QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that Qualcomm is the first fabless integrated circuit company to participate in IMEC's industrial affiliation program (IIAP) on three-dimensional (3D) integration. Qualcomm and IMEC researchers in the program will collaborate to understand and develop solutions for the use of 3D technologies in future wireless products.

Qualcomm and IMEC Collaborate on 3D Integration Research

LEUVEN, Belgium & SAN DIEGO, CA | Posted on July 14th, 2008

"Now that Qualcomm, the world's leading fabless integrated circuit provider, has joined the 3D integration program, we have all the major supply chain players working together," said Luc Van den hove, chief operation officer at IMEC. "We are confident that strong industry collaboration among foundries, IDMs, packaging and assembly companies, and equipment suppliers at IMEC will push the development of innovative 3D products forward."

IMEC's 3D integration program explores three dimensional technology and design for application in various domains. The technology research program focuses on 3D wafer-level packaging and 3D stacked-ICs to find innovative solutions for the cost-effective use of 3D interconnects at different levels of the wiring hierarchy. The 3D system-on-chip design research program provides insights to its benefits, costs, challenges and solutions. The program will also include the development and demonstration of the IP and tools necessary for designing in three dimensions.

"Three-dimensional design will allow Qualcomm to offer superior features and performance in our products," said Jim Clifford, senior vice president and general manager, Qualcomm CDMA Technologies. "We are collaborating with IMEC because their research and technology expertise will help us to accelerate the implementation of 3D design in our products."

Other partners in IMEC's 3D integration program are Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.

The news release can be downloaded at:

www.imec.be/wwwinter/mediacenter/en/Qualcomm3DSemWest.shtml

About Qualcomm

Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2008 FORTUNE 500 company traded on The Nasdaq Stock Market under the ticker symbol QCOM.

####

About IMEC
IMEC is a world-leading independent research center in nanoelectronics and nanotechnology. IMEC vzw is headquartered in Leuven, Belgium and has a sister company in the Netherlands, IMEC-NL, offices in the US, China and Taiwan, and representatives in Japan. Its staff of more than 1,600 people includes more than 500 industrial residents and guest researchers. In 2007, its revenue (P&L) was EUR 244.5 million.

IMECs More-than-Moore research aims at semiconductor scaling towards sub-32nm nodes. With its More than Moore research, IMEC looks into technologies for nomadic embedded systems, wireless autonomous transducer solutions, biomedical electronics, photovoltaics, organic electronics and GaN power electronics.

IMECs research bridges the gap between fundamental research at universities and technology development in industry. Its unique balance of processing and system know-how, intellectual property portfolio, state-of-the-art infrastructure and its strong network worldwide position IMEC as a key partner for shaping technologies for future systems. Further information on IMEC can be found at www.imec.be.

NOTE: Qualcomm is a registered trademark of Qualcomm Incorporated. All other trademarks are the property of their respective owners.

For more information, please click here

Contacts:


Qualcomm
Qualcomm Europe
Richard Tinkler, +44-7720-060619

or
Qualcomm CDMA Technologies
Carla Vallone, +1-858-651-8557

or
Investor Relations
John Gilbert, 1-858-658-4813

or
IMEC
Corporate Communications Director
Katrien Marent, +32 16 28 18 80
M : +32 474 30 28 66

or
Maestro Marketing & PR
Barbara Kalkis, +1-408-996-9975

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Ultrathin device harvests electricity from human motion July 23rd, 2017

The July 23 close fly-by of asteroid 2017 BS5 is explored in a Q&A with Dr. John S. Lewis, chief scientist at Deep Space Industries July 23rd, 2017

Scientists announce the quest for high-index materials: All-dielectric nanophotonics: The quest for better materials and fabrication techniques July 22nd, 2017

Pulses of electrons manipulate nanomagnets and store information: Scientists use electron pulses to create and manipulate nanoscale magnetic excitations that can store data July 21st, 2017

Announcements

Ultrathin device harvests electricity from human motion July 23rd, 2017

The July 23 close fly-by of asteroid 2017 BS5 is explored in a Q&A with Dr. John S. Lewis, chief scientist at Deep Space Industries July 23rd, 2017

Scientists announce the quest for high-index materials: All-dielectric nanophotonics: The quest for better materials and fabrication techniques July 22nd, 2017

Pulses of electrons manipulate nanomagnets and store information: Scientists use electron pulses to create and manipulate nanoscale magnetic excitations that can store data July 21st, 2017

Alliances/Trade associations/Partnerships/Distributorships

GLOBALFOUNDRIES and VeriSilicon To Enable Single-Chip Solution for Next-Gen IoT Networks: Integrated solution leverages GFs 22FDX technology to decrease power, area, and cost for NB-IoT and LTE-M applications July 14th, 2017

Advanced Nanomechanical Characterization Centre Open in India: Nanomechanics, Inc. announces the establishment of the joint technology development center in Hyderabad, India July 5th, 2017

U.S. Air Force Research Lab Taps IBM to Build Brain-Inspired AI Supercomputing System: Equal to 64 million neurons, new neurosynaptic supercomputing system will power complex AI tasks at unprecedented speed and energy efficiency June 23rd, 2017

Cambridge Nanotherm partners with Inabata for global sales and distribution June 20th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project