Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Qualcomm and IMEC Collaborate on 3D Integration Research

IMEC, Europe's leading independent nanoelectronics research institute, and Qualcomm Incorporated (Nasdaq:QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that Qualcomm is the first fabless integrated circuit company to participate in IMEC's industrial affiliation program (IIAP) on three-dimensional (3D) integration. Qualcomm and IMEC researchers in the program will collaborate to understand and develop solutions for the use of 3D technologies in future wireless products.

Qualcomm and IMEC Collaborate on 3D Integration Research

LEUVEN, Belgium & SAN DIEGO, CA | Posted on July 14th, 2008

"Now that Qualcomm, the world's leading fabless integrated circuit provider, has joined the 3D integration program, we have all the major supply chain players working together," said Luc Van den hove, chief operation officer at IMEC. "We are confident that strong industry collaboration among foundries, IDMs, packaging and assembly companies, and equipment suppliers at IMEC will push the development of innovative 3D products forward."

IMEC's 3D integration program explores three dimensional technology and design for application in various domains. The technology research program focuses on 3D wafer-level packaging and 3D stacked-ICs to find innovative solutions for the cost-effective use of 3D interconnects at different levels of the wiring hierarchy. The 3D system-on-chip design research program provides insights to its benefits, costs, challenges and solutions. The program will also include the development and demonstration of the IP and tools necessary for designing in three dimensions.

"Three-dimensional design will allow Qualcomm to offer superior features and performance in our products," said Jim Clifford, senior vice president and general manager, Qualcomm CDMA Technologies. "We are collaborating with IMEC because their research and technology expertise will help us to accelerate the implementation of 3D design in our products."

Other partners in IMEC's 3D integration program are Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.

The news release can be downloaded at:

About Qualcomm

Qualcomm Incorporated ( is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2008 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.


About IMEC
IMEC is a world-leading independent research center in nanoelectronics and nanotechnology. IMEC vzw is headquartered in Leuven, Belgium and has a sister company in the Netherlands, IMEC-NL, offices in the US, China and Taiwan, and representatives in Japan. Its staff of more than 1,600 people includes more than 500 industrial residents and guest researchers. In 2007, its revenue (P&L) was EUR 244.5 million.

IMEC’s More-than-Moore research aims at semiconductor scaling towards sub-32nm nodes. With its More than Moore research, IMEC looks into technologies for nomadic embedded systems, wireless autonomous transducer solutions, biomedical electronics, photovoltaics, organic electronics and GaN power electronics.

IMEC’s research bridges the gap between fundamental research at universities and technology development in industry. Its unique balance of processing and system know-how, intellectual property portfolio, state-of-the-art infrastructure and its strong network worldwide position IMEC as a key partner for shaping technologies for future systems. Further information on IMEC can be found at

NOTE: Qualcomm is a registered trademark of Qualcomm Incorporated. All other trademarks are the property of their respective owners.

For more information, please click here


Qualcomm Europe
Richard Tinkler, +44-7720-060619

Qualcomm CDMA Technologies
Carla Vallone, +1-858-651-8557

Investor Relations
John Gilbert, 1-858-658-4813

Corporate Communications Director
Katrien Marent, +32 16 28 18 80
M : +32 474 30 28 66

Maestro Marketing & PR
Barbara Kalkis, +1-408-996-9975

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

The quantum sniffer dog: A laser and detector in 1: A microscopic sensor has been developed at TU Wien, which can be used to identify different gases simultaneously October 25th, 2016

Hybrid nanostructures hold hydrogen well: Rice University scientists say boron nitride-graphene hybrid may be right for next-gen green cars October 25th, 2016

When quantum scale affects the way atoms emit and absorb particles of light: Exact simulation lifts the 80-year-old mystery of the degree to which atoms can be dressed with photons October 24th, 2016

Nanoantenna lighting-rod effect produces fast optical switches October 24th, 2016


The quantum sniffer dog: A laser and detector in 1: A microscopic sensor has been developed at TU Wien, which can be used to identify different gases simultaneously October 25th, 2016

Hybrid nanostructures hold hydrogen well: Rice University scientists say boron nitride-graphene hybrid may be right for next-gen green cars October 25th, 2016

New nanomedicine approach aims to improve HIV drug therapies October 24th, 2016

New method increases energy density in lithium batteries: Novel technique may lead to longer battery life in portable electronics and electrical vehicles October 24th, 2016

Alliances/Trade associations/Partnerships/Distributorships

Enterprise In Space Partners with Sketchfab and 3D Hubs for NewSpace Education October 13th, 2016

Arrowhead and Spring Bank Announce Clinical Collaboration for ARC-520 and SB 9200 in Chronic Hepatitis B October 6th, 2016

STMicroelectronics’ Semiconductor Chips Contribute to Connected Toothbrush from Oral-B That Sees What You Don’t: Microcontroller and Accelerometer help brushers clean their teeth more effectively October 4th, 2016

Leti to Tackle Tomorrow's Research Strategies with Stanford University’s SystemX Alliance: French R&D Center Is the First Research Institute to Join the Collaboration and Provides Bridges Between Academia and Industry, Leveraging Alliance’s Potential October 4th, 2016

The latest news from around the world, FREE

  Premium Products
Only the news you want to read!
 Learn More
University Technology Transfer & Patents
 Learn More
Full-service, expert consulting
 Learn More

Nanotechnology Now Featured Books


The Hunger Project