Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SEMATECH Announces Speaker Lineup for SEMICON West

Abstract:
Experts' Keynotes to Highlight Industry Trends, Technical and Manufacturing Solutions

SEMATECH Announces Speaker Lineup for SEMICON West

Austin, TX | Posted on July 8th, 2008

SEMATECH's thought leaders and technical experts will be on hand during SEMICON West, July 15-17, 2008, to discuss technical and manufacturing solutions that will enable continued progress in device scaling.

SEMATECH President and CEO Dr. Michael Polcari said, "Throughout the week, the semiconductor community will have the opportunity to hear our technology experts address the industry's most critical challenges and provide unprecedented access to the information needed to guide implementation of strategies and best practices."

The lineup includes an appearance by John Warlaumont, SEMATECH's vice president of advanced technology, as a keynote speaker at JEMI France and SEMI's co-organized seminar on "Strategic Research Alliances." Warlaumont will join four other executives in addressing the importance of collaborative research alliances in the semiconductor and related industries during a technical session beginning at 10:30 a.m. Tuesday, July 15 in the Golden Gate (A2) Conference Room of the San Francisco Marriott.

Additionally, four expert technologists representing SEMATECH and its subsidiary International SEMATECH Manufacturing Initiative (ISMI) will appear on the Device Scaling TechXPOT Stage. Their talks, which will cover front-end scaling, enhanced fab productivity, extreme ultraviolet lithography, e-manufacturing, and nanoscale metrology—are detailed below.

"CMOS Scaling for High-Mobility Channels"
Prashant Majhi, Front End Processes program manager for CMOS Scaling, SEMATECH
10:50 a.m. Tuesday, July 15

Majhi will address trends in CMOS scaling and the impact of key process elements on performance—including increasing reliance on new materials and architectures, the development of non-planar alternatives, and the need to reduce operating voltages—and how these trends can be addressed through heterogeneous integration and system level improvements.

"The Green Fab Challenge: Going Clean, Going Green"
10:50 a.m. Wednesday, July 16
James Beasley, Environmental Safety and Health technology manager,
ISMI

Beasley will discuss ISMI efforts to produce a standard methodology and approach for evaluating and certifying semiconductor facility environmental performance based on the U.S. Green Building Council's Leadership in Energy and Environmental Design (LEED) Green Building rating system.

"Metrology Readiness for the 45-32nm Nodes"
Benjamin Bunday, Project Manager of CD Metrology and Senior Member Technical Staff, ISMI
11:10 a.m. Wednesday, July 16

Bunday will highlight the status of CD, overlay, thin film and defect metrology equipment for future manufacturing, and will present high-level results from ISMI's Metrology program as compared to the specified requirements from the ITRS.

"3D Device Issues at 22nm Node and Beyond"
Rusty Harris, Front End Processes project manager for non-planar CMOS, SEMATECH
3:50 p.m. Wednesday, July 16

Harris will explore several key requirements for making 3D devices a reality and will look ahead at the future of 3D devices.

####

About SEMATECH
For 20 years, SEMATECH® (www.sematech.org) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
SEMATECH
Erica McGill
518-956-7446

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Information storage with a nanoscale twist: Discovery of a novel rotational force inside magnetic vortices makes it easier to design ultrahigh capacity disk drives March 28th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Laser activated gold pyramids could deliver drugs, DNA into cells without harm: Microstructures create temporary pores in cells March 27th, 2017

Chip Technology

A big leap toward tinier lines: Self-assembly technique could lead to long-awaited, simple method for making smaller microchip patterns March 27th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Argon is not the 'dope' for metallic hydrogen March 24th, 2017

Scientists discover new 'boat' form of promising semiconductor: GeSe Uncommon form attenuates semiconductor's band gap size March 23rd, 2017

Announcements

Information storage with a nanoscale twist: Discovery of a novel rotational force inside magnetic vortices makes it easier to design ultrahigh capacity disk drives March 28th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Laser activated gold pyramids could deliver drugs, DNA into cells without harm: Microstructures create temporary pores in cells March 27th, 2017

Events/Classes

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Leti Presents Advances in Propagation Modeling and Antenna Design for mmWave Spectrum: Paper Is One of 15 that Leti Presented at European Conference on Antennas and Propagation March 19-24 March 23rd, 2017

Next-gen steel under the microscope March 18th, 2017

UC researchers use gold coating to control luminescence of nanowires: University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper March 17th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project