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June 28th, 2008
Whoever penned the old adage "a watched pot never boils" surely never tried to heat up water in a pot lined with copper nanorods.
A new study from researchers at Rensselaer Polytechnic Institute shows that by adding an invisible layer of the nanomaterials to the bottom of a metal vessel, an order of magnitude less energy is required to bring water to boil. This increase in efficiency could have a big impact on cooling computer chips, improving heat transfer systems, and reducing costs for industrial boiling applications.
"Like so many other nanotechnology and nanomaterials breakthroughs, our discovery was completely unexpected," said Nikhil A. Koratkar, associate professor in the Department of Mechanical, Aerospace, and Nuclear Engineering at Rensselaer, who led the project. "The increased boiling efficiency seems to be the result of an interesting interplay between the nanoscale and microscale surfaces of the treated metal. The potential applications for this discovery are vast and exciting, and we're eager to continue our investigations into this phenomenon."
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