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Home > Press > NEXX Systems to Participate in IMEC's Industrial Affiliation Program on 3D Integration

Abstract:
NEXX Systems, a leading provider of process equipment for advanced wafer-level packaging applications, today announced its participation in IMEC's Industrial Affiliation Program (IIAP) on 3D integration. As a member of this program, NEXX Systems will install a Stratus S300-FX electrodeposition system at IMEC's facility in Leuven, Belgium for joint research and development of the metallization of through silicon vias (TSVs) and micro-bumping. The TSVs and micro-bumps are fabricated with electrodeposition technology and play a key role in 3D integration.

NEXX Systems to Participate in IMEC's Industrial Affiliation Program on 3D Integration

BILLERICA, MA and LEUVEN, Belgium | Posted on June 17th, 2008

"We are delighted to continue our partnership with NEXX Systems and are confident that the Stratus will give our partners leading-edge electrodeposition technology for 3D integration," explained Eric Beyne, program director of the Advanced Packaging and Interconnect Center at IMEC.

"3D integration is an exciting new technology that addresses the ever-increasing demands for smaller, more complex, electronic devices," said Richard Post, NEXX's CEO. "Our partnership with IMEC will enhance continuing efforts to develop robust, low cost electroplating solutions that will enable future products for consumer electronics as well as automotive, medical, and office networking applications."

About IMEC: IMEC is a leading independent non-profit research center in nanoelectronics and nanotechnology focusing on the next generations of chips and systems, and on the enabling technologies for ambient intelligence. IMEC is headquartered in Leuven, Belgium, and further information on IMEC can be found at www.imec.be.

####

About NEXX Systems
NEXX Systems brings exceptional technical expertise to advanced packaging and 3D integration. Our product lines provide the most efficient, yet affordable, systems of their kind: Apollo and Nimbus for multi-layer sputter deposition of metals, and Stratus for high throughput electro-deposition of metals. Additional information can be found at: www.nexxsystems.com.

“Safe Harbor” statement: This release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 regarding future events or the future performance of NEXX Systems. These statements are only predictions. Actual events or results may differ materially from those in other forward-looking statements set forth herein. Among the important factors that could cause actual events to differ materially from those in other forward-looking statements are potential fluctuations in quarterly results, dependence on new product development, rapid technological and market change, acquisition strategy, manufacturing and sourcing risks, volatility of stock price, international operations, financial risk management, and future growth subject to risks. NEXX Systems is under no obligation to, and expressly disclaims any obligation to, update or alter its forward-looking statements, whether as a result of new information, future events or otherwise.

For more information, please click here

Contacts:
NEXX Systems
Richard S. Post
978-932-2030
Chief Executive Officer

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