Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > NEXX Systems to Participate in IMEC's Industrial Affiliation Program on 3D Integration

Abstract:
NEXX Systems, a leading provider of process equipment for advanced wafer-level packaging applications, today announced its participation in IMEC's Industrial Affiliation Program (IIAP) on 3D integration. As a member of this program, NEXX Systems will install a Stratus S300-FX electrodeposition system at IMEC's facility in Leuven, Belgium for joint research and development of the metallization of through silicon vias (TSVs) and micro-bumping. The TSVs and micro-bumps are fabricated with electrodeposition technology and play a key role in 3D integration.

NEXX Systems to Participate in IMEC's Industrial Affiliation Program on 3D Integration

BILLERICA, MA and LEUVEN, Belgium | Posted on June 17th, 2008

"We are delighted to continue our partnership with NEXX Systems and are confident that the Stratus will give our partners leading-edge electrodeposition technology for 3D integration," explained Eric Beyne, program director of the Advanced Packaging and Interconnect Center at IMEC.

"3D integration is an exciting new technology that addresses the ever-increasing demands for smaller, more complex, electronic devices," said Richard Post, NEXX's CEO. "Our partnership with IMEC will enhance continuing efforts to develop robust, low cost electroplating solutions that will enable future products for consumer electronics as well as automotive, medical, and office networking applications."

About IMEC: IMEC is a leading independent non-profit research center in nanoelectronics and nanotechnology focusing on the next generations of chips and systems, and on the enabling technologies for ambient intelligence. IMEC is headquartered in Leuven, Belgium, and further information on IMEC can be found at www.imec.be.

####

About NEXX Systems
NEXX Systems brings exceptional technical expertise to advanced packaging and 3D integration. Our product lines provide the most efficient, yet affordable, systems of their kind: Apollo and Nimbus for multi-layer sputter deposition of metals, and Stratus for high throughput electro-deposition of metals. Additional information can be found at: www.nexxsystems.com.

“Safe Harbor” statement: This release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 regarding future events or the future performance of NEXX Systems. These statements are only predictions. Actual events or results may differ materially from those in other forward-looking statements set forth herein. Among the important factors that could cause actual events to differ materially from those in other forward-looking statements are potential fluctuations in quarterly results, dependence on new product development, rapid technological and market change, acquisition strategy, manufacturing and sourcing risks, volatility of stock price, international operations, financial risk management, and future growth subject to risks. NEXX Systems is under no obligation to, and expressly disclaims any obligation to, update or alter its forward-looking statements, whether as a result of new information, future events or otherwise.

For more information, please click here

Contacts:
NEXX Systems
Richard S. Post
978-932-2030
Chief Executive Officer

Copyright © Business Wire 2008

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

Long nanotubes make strong fibers: Rice University researchers advance characterization, purification of nanotube wires and films October 17th, 2017

Spinning strands hint at folding dynamics: Rice University lab uses magnetic beads to model microscopic proteins, polymers October 17th, 2017

Spin current detection in quantum materials unlocks potential for alternative electronics October 15th, 2017

Quantum manipulation power for quantum information processing gets a boost: Improving the efficiency of quantum heat engines involves reducing the number of photons in a cavity, ultimately impacting quantum manipulation power October 14th, 2017

Chip Technology

Spin current detection in quantum materials unlocks potential for alternative electronics October 15th, 2017

Quantum manipulation power for quantum information processing gets a boost: Improving the efficiency of quantum heat engines involves reducing the number of photons in a cavity, ultimately impacting quantum manipulation power October 14th, 2017

Injecting electrons jolts 2-D structure into new atomic pattern: Berkeley Lab study is first to show potential of energy-efficient next-gen electronic memory October 13th, 2017

Rice U. lab surprised by ultraflat magnets: Researchers create atom-thick alloys with unanticipated magnetic properties October 13th, 2017

Nanoelectronics

Nanometrics Announces Preliminary Results for the Third Quarter of 2017: Quarterly Results Impacted by Delays in Revenue Recognition on Multiple Systems into Japan October 12th, 2017

Seeing the next dimension of computer chips: Researchers image perfectly smooth side-surfaces of 3-D silicon crystals with a scanning tunneling microscope, paving the way for smaller and faster computing devices October 11th, 2017

Columbia engineers invent breakthrough millimeter-wave circulator IC October 6th, 2017

Tungsten offers nano-interconnects a path of least resistance: Crystalline tungsten shows insight and promise in addressing the challenges of electrical interconnects that have high resistivity at the nanoscale October 4th, 2017

Announcements

Long nanotubes make strong fibers: Rice University researchers advance characterization, purification of nanotube wires and films October 17th, 2017

Spinning strands hint at folding dynamics: Rice University lab uses magnetic beads to model microscopic proteins, polymers October 17th, 2017

Rice U. study: Vibrating nanoparticles interact: Placing nanodisks in groups can change their vibrational frequencies October 16th, 2017

Spin current detection in quantum materials unlocks potential for alternative electronics October 15th, 2017

Tools

Nanometrics Announces Preliminary Results for the Third Quarter of 2017: Quarterly Results Impacted by Delays in Revenue Recognition on Multiple Systems into Japan October 12th, 2017

Seeing the next dimension of computer chips: Researchers image perfectly smooth side-surfaces of 3-D silicon crystals with a scanning tunneling microscope, paving the way for smaller and faster computing devices October 11th, 2017

Quorum announces new customer support and demonstration facilities for users worldwide October 10th, 2017

Graphene forged into three-dimensional shapes September 26th, 2017

Alliances/Trade associations/Partnerships/Distributorships

More 22 of 59,885 Print all In new window Leti to Present Update of CoolCube/3DVLSI Technologies Development at 2017 IEEE S3S: Future Developments and Tape-Out Vehicles to Be Presented during Oct. 17 Workshop October 12th, 2017

Quorum announces new customer support and demonstration facilities for users worldwide October 10th, 2017

GLOBALFOUNDRIES and Soitec Enter Into Long-term Supply Agreement on FD-SOI Wafers: Strategic milestone to help guarantee a secure, high-volume supply of FD-SOI technology September 20th, 2017

GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications: Technology platforms are uniquely positioned to enable a new era of ‘connected intelligence’ with the transition to 5G September 20th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project