Nanotechnology Now - Press Release: SUSS Automated Bond Cluster Selected for MEMS Foundry in Korea

Home > Press > SUSS Automated Bond Cluster Selected for MEMS Foundry in Korea

Abstract:
SUSS MicroTec (FWB:SMH) (GER:SMH), a leading supplier of process and test solutions for the semiconductor industry,announced today that u-ITC, Korea, has selected the advanced wafer bonding equipment of SUSS for its MEMS foundry.

SUSS Automated Bond Cluster Selected for MEMS Foundry in Korea

WATERBURY, VT | Posted on May 29th, 2008

u-ITC is a world class MEMS foundry specializing in MEMS sensors. The Incheon facility will incorporate design, manufacture, assembly and test within one location for the growing fabless MEMS market.

"The SUSS ABC200 Automated Bond Cluster is a key acquisition for our foundry operations," said Suh, Dong-Ryang Ph.D, Director at u-ITC, "we can easily meet our customers' needs by using a cluster tool that can be quickly reconfigured for changing process conditions."

"The flexibility of the SUSS bond cluster to quickly reconfigure process parameters from small runs to full production is a big advantage of the toolset, especially in the case of a foundry serving new markets," said Daniel T. Hurley, International Product Manager, Wafer Bonder Division, SUSS MicroTec. "We are pleased to support u-ITC as they establish themselves as the primary best in class MEMS foundry in Korea."

The ABC200 is a 200mm Automated Bond Cluster. It delivers superior post-bond alignment accuracy resulting from precision mechanics, uniform force capability and leading edge temperature control. SUSS MicroTec offers advanced wafer bonding solutions for the MEMS, SOI, Optoelectronics, and 3D Interconnect markets.

####

About SUSS MicroTec
SUSS Micro Tec Inc. is a part of the SUSS MicroTec group listed in Deutsche Börse AG’s Prime Standard.

SUSS MicroTec is one of the world’s leading suppliers of process and testing solutions for markets such as advanced packaging, MEMS, nanotechnology, compound semiconductor, Silicon-On-Insulator and 3D Interconnect. SUSS MicroTec enables its customers to increase process performance while reducing cost of ownership and to meet the volume requirements of fast growing markets with high quality solutions.

SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service.

Headquartered in Garching near Munich, Germany, SUSS MicroTec employs more than 730 employees worldwide.

All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.

For more information, please click here

Contacts:
SUSS MicroTec Inc.
Marketing Communications Manager, Leah McMahon
Phone: +1-800-685-7877

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark: