- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced it has received an order from the largest foundry in the world for its AP300 advanced-packaging lithography system. This AP300 lithography system order represents the initial step in the foundry customer's volume expansion plans for 300mm wafer-level packaging (WLP) and solder bump applications.
According to Jan Vardaman, president and founder of TechSearch International, Inc., the wafer-level packaging market is positioned for strong unit growth over the next several years, with an expected compound annual growth rate of approximately 25 percent. This growth is mainly driven by devices found in mobile phones, along with strong expected demand for analog and power management devices.
"This order exemplifies how Ultratech delivers technology leadership and high economic value to the foundry market. While contact and proximity aligners introduce yield defects and have high variable manufacturing costs, the use of our stepper technology provides outstanding cost-of-ownership advantages for high-volume manufacturing applications," said Manish Ranjan, director, product marketing for advanced packaging technology at Ultratech. "To accommodate the stringent economic and technology requirements for this market segment, our customer conducted an extensive equipment evaluation and selected the Unity AP300 equipment. We greatly value our relationship with this customer and are committed to supporting its high-volume production requirements for wafer-level packaging and solder bump applications. "
Built on Ultratech's customizable Unity Platform(TM), the AP300 system is designed to provide customers with significant cost of ownership (CoO), operational flexibility, and leading technology advantages that have earned the system industry-standard ranking for thick-resist exposure applications.
Certain of the statements contained herein, which are not historical facts and which can generally be identified by words such as "anticipates," "expects," "intends," "will," "could," "believes," "estimates," "continue," and similar expressions, are forward-looking statements under Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, that involve risks and uncertainties, such as risks related to our dependence on new product introductions and market acceptance of new products and enhanced versions of our existing products; lengthy sales cycles, including the timing of system installations and acceptances; lengthy and costly development cycles for laser-processing and lithography technologies and applications; integration, development and associated expenses of the laser processing operation; delays, deferrals and cancellations of orders by customers; cyclicality in the semiconductor and nanotechnology industries; general economic conditions including impact to capital spending; pricing pressures and product discounts; high degree of industry competition; intellectual property matters; expiration of licensing arrangements, and the resulting adverse impact on our licensing revenues; changes to financial accounting standards; changes in pricing by us, our competitors or suppliers; customer concentration; international sales; timing of new product announcements and releases by us or our competitors; ability to volume produce systems and meet customer requirements; sole or limited sources of supply; ability and resulting costs to attract or retain sufficient personnel to achieve our targets for a particular period; dilutive effect of employee stock option grants on net income per share, which is largely dependent upon us achieving and maintaining profitability and the market price of our stock; mix of products sold; rapid technological change and the importance of timely product introductions; outcome of litigation; manufacturing variances and production levels; timing and degree of success of technologies licensed to outside parties; product concentration and lack of product revenue diversification; inventory obsolescence; asset impairment; effects of certain anti-takeover provisions; announced and future acquisitions; volatility of stock price; foreign government regulations and restrictions; business interruptions due to natural disasters or utility failures; environmental regulations; and any adverse effects of terrorist attacks in the United States or elsewhere, or government responses thereto, or military actions in Iraq, Afghanistan and elsewhere, on the economy, in general, or on our business in particular. Such risks and uncertainties are described in Ultratech's SEC reports including its Annual Report on Form 10-K filed for the year ended December 31, 2007 and its Quarterly Report on Form 10-Q filed for the quarter ended March 29, 2008. Due to these and additional factors, the statements, historical results and percentage relationships set forth herein are not necessarily indicative of the results of operations for any future period. These forward-looking statements are based on management's current beliefs and expectations, some or all of which may prove to be inaccurate, and which may change. We undertake no obligation to revise or update any forward-looking statements to affect any event or circumstance that may arise after the date of this release.
About Ultratech, Inc.
Ultratech, Inc. (Nasdaq: UTEK) Founded in 1979, Ultratech is a leader in both of its major technology markets-advanced packaging and laser processing. The company’s advanced packaging lithography systems are designed to deliver compelling yield gains and superior packaging performance at the industry’s lowest overall cost of ownership. Equally impressive is Ultratech’s laser processing technology which is designed to increase chip performance while reducing energy consumption. Ultratech believes its state-of-the-art technologies enable future device generations by providing highly reliable, cost-effective technology solutions that enable today’s and tomorrow’s sophisticated devices.
For more information, please click here
Copyright © PR Newswire Association LLC.If you have a comment, please Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
News and information
Simple attraction: Researchers control protein release from nanoparticles without encapsulation: U of T Engineering discovery stands to improve reliability and fabrication process for treatments to conditions such as spinal cord damage and stroke May 28th, 2016
Doubling down on Schrödinger's cat May 27th, 2016
Deep Space Industries and SFL selected to provide satellites for HawkEye 360’s Pathfinder mission: The privately-funded space-based global wireless signal monitoring system will be developed by Deep Space Industries and UTIAS Space Flight Laboratory May 26th, 2016
Gigantic ultrafast spin currents: Scientists from TU Wien (Vienna) are proposing a new method for creating extremely strong spin currents. They are essential for spintronics, a technology that could replace today's electronics May 25th, 2016
Dartmouth team creates new method to control quantum systems May 24th, 2016
Attosecond physics: A switch for light-wave electronics May 24th, 2016
Doubling down on Schrödinger's cat May 27th, 2016
Electrically Conductive Graphene Ink Enables Printing of Biosensors April 23rd, 2016
Highlights from the Graphene Flagship April 22nd, 2016