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Millios(TM) Flash RTP System Enables Advanced 45 nm and Beyond Processes
Mattson Technology, Inc. , a leading supplier of advanced semiconductor process equipment used to manufacture Integrated Circuits (or "ICs"), today announced that a leading global semiconductor manufacturer has selected its Millios(TM) flash Rapid Thermal Processing (fRTP) system for advanced millisecond anneal processing based on its capabilities to address challenging sub-45 nanometer applications. The fRTP annealing system is scheduled to ship to the manufacturer's 300 mm advanced development fab in May, where it will be used for process and performance characterization of critical flash RTP applications. Gartner Dataquest estimates that the total emerging millisecond RTP anneals market is expected to grow at a 12 percent compound annual growth rate (CAGR) from 2007 to 2012.
"As the number of implant steps increases with each device generation, chipmakers face a myriad of complex technical challenges in which they must achieve increasingly smaller geometries and fabricate more powerful chips," noted Andreas Toennis, senior vice president and general manager of Mattson Technology's Thermal Products Group. "Mattson's proprietary Millios system provides critical technical improvements in process flexibility, control and high throughput, resulting in low cost of ownership. With its superior technical innovations, including an extremely powerful flash lamp which is essential for the fRTP application, Millios enables high throughput and may eliminate the need for separate spike anneal. Millios is the only tool that delivers full manufacturing controls with the ability to combine standard and millisecond anneals."
Toennis added, "The Millios system has already demonstrated the advanced capabilities to address advanced 45 nm and beyond processes and is well positioned to drive Mattson's growth. We look forward to working with this latest Millios customer, and are committed to supporting their expanded production capabilities in the future as well as their growth strategy to meet their customers' anticipated demand for leading-edge semiconductors, telecommunications, and digital convergence technology."
In the nanotechnology era, where chips have features 1000 times smaller than the diameter of a human hair, advanced RTP applications will require annealing that is fractions of, to a few thousandths of, a second in duration. Mattson's Millios(TM) Flash-Assist RTP (fRTP) is a next-generation millisecond annealing tool featuring advanced process control and high throughput to meet manufacturing and development needs. The technique offers effective process times of 1-3 milliseconds. The system features a patented arc lamp technology that processes the wafers through millisecond "flashes" (similar to a camera flash), providing improved thermal control for ultra-shallow junction (USJ) anneal and other advanced applications through the 22 nm regime. Millios also combines fully automated wafer handling hardware and software from Mattson's production-proven Helios(TM) RTP system. Millios was qualified in 2007 by semiconductor and leading nanoelectronics research centers in Europe and the United States.
About Mattson Technology, Inc.
Mattson Technology, Inc. is a leading supplier of dry strip equipment and the second largest supplier of rapid thermal processing equipment in the global semiconductor industry. The company's strip and RTP equipment utilize innovative technology to deliver advanced processing performance and productivity gains to semiconductor manufacturers worldwide for the fabrication of current- and next-generation devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911.
"Safe Harbor" Statement Under the Private Securities Litigation Reform Act of 1995:
This news release contains forward-looking statements regarding the Company's future prospects. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially. Such risks and uncertainties include, but are not limited to: end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company's products; customer acceptance of delivered products and the Company's ability to collect amounts due upon shipment and upon acceptance; the Company's ability to timely manufacture, deliver and support ordered products; the Company's ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company's competitors; the Company's ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company's Forms 10-K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.
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