Home > Press > Applied Materials Sets the Standard for 32nm Mask Cleaning with New Tetra Reticle Clean System
 |
| The Applied Tetra Reticle Clean delivers damage-free, greater than 99% particle removal efficiency for 32nm and beyond photomasks, with the up to four times the throughput of any competitive system. (Photo: Business Wire) |
Abstract:
Applied Materials, Inc. today released its Applied Tetra™ Reticle Clean, the industry's only wet clean system that delivers damage-free, >99% particle removal efficiency for 32nm-and-beyond photomasks. Enabling customers to exceed 32nm specifications for critical mask cleaning applications, the compact Tetra Reticle Clean system also sets a new standard for productivity, offering up to four times the throughput of any competing system.
Applied Materials Sets the Standard for 32nm Mask Cleaning with New Tetra Reticle Clean System
TOKYO, Japan | Posted on April 15th, 2008
"Conventional photomask cleaning systems have not been able to meet the challenge of cleaning leading-edge masks effectively without damaging them," said Ajay Kumar, general manager of Applied Materials' Mask Etch and Cleans product division. "We've overcome this technology barrier with the Tetra Reticle Clean system, enabling mask makers to achieve the rapid cleaning performance they need while maintaining the mask feature integrity and phase control that their customers demand."
The Tetra Reticle Clean system's remarkable performance, which has already been validated in a 45nm production environment, is the result of several innovations in cleaning technology. The system features a unique, flexible design and sulfur-free, advanced ammonia-based cleaning agents that combine to maximize photoresist and particle removal without damaging the mask. Proprietary Uniform Cavitation Megasonics™ (UCM) technology distributes energy evenly over the entire mask surface, avoiding the damage-causing spikes generated by traditional point-source megasonic[1] cleans. The Tetra Reticle Clean system also introduces NanoDroplet™ technology which utilizes a unique nozzle design to create small, uniform, high-momentum droplets that evenly distribute energy and help deliver 32nm-and-beyond cleaning performance.
The benchmark high throughput of the Tetra Reticle Clean system is enabled by its ability to treat both sides of the mask simultaneously, cutting process time in half compared to other cleaning systems. This feature enables extendibility to future mask generations by allowing different chemistries to be used on each side without mixing. The system can be configured with multiple processing modules, offering mask makers the capacity to eliminate processing bottlenecks and reduce cycle times. For more information on the Applied Tetra Reticle Clean, visit www.appliedmaterials.com/products/reticle_clean_4.html.
The Tetra Reticle Clean system is part of Applied's expanding portfolio of photomask manufacturing and inspection solutions. The Applied Tetra Reticle Etch system is used by virtually every advanced mask shop in the world for 45nm photomask development and production. The Applied Aera2™ Mask Inspection system, just announced today, enables customers to immediately see what pattern will be printed on the wafer. These solutons will be showcased at the Applied Materials Technical Forum in Yokohama, Japan, on April 15 during SPIE Photomask Japan 2008. Visit www.appliedmaterials.com/2008_PMJ.
####
About Applied Materials, Inc.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live.
[1] Megasonic = the rapid formation and collapse of bubbles in a liquid caused by high-frequency pressure waves
For more information, please click here
Contacts:
Applied Materials, Inc.
Betty Newboe
408-563-0647 (editorial/media)
Linda Heller
408-986-7977 (financial community)
Copyright © Business Wire 2008
If you have a comment, please
Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Bookmark:
News and information
Less is More: Novel Cellulose Structure Requires Fewer Enzymes to Process Biomass to Fuel June 19th, 2013
Sound waves precisely position nanowires June 19th, 2013
Scientists Use Nanotechnology to Increase Thermal Stability of Essential Oils June 19th, 2013
Production of Bioactive Material for Quick Treatment of Bone Damages June 19th, 2013
Chip Technology
Sound waves precisely position nanowires June 19th, 2013
Nanometrics Announces Participation in 5th Annual CEO Investor Summit: Accredited Investor and Publishing Research Analyst Event to be Held Concurrently With SEMICON West and Intersolar 2013 in San Francisco June 19th, 2013
Which qubit my dear? New method to distinguish between neighbouring quantum bits June 18th, 2013
SEMATECH to Address Critical Supply Chain Challenges and Present Latest Technology Advances at SEMICON West 2013 June 17th, 2013
Announcements
Less is More: Novel Cellulose Structure Requires Fewer Enzymes to Process Biomass to Fuel June 19th, 2013
Sound waves precisely position nanowires June 19th, 2013
Scientists Use Nanotechnology to Increase Thermal Stability of Essential Oils June 19th, 2013
Production of Bioactive Material for Quick Treatment of Bone Damages June 19th, 2013
Tools
Beating the Diffraction Limit by 1000X – An introduction to nanoscale IR imaging on Bruker AFMs with applications in graphene June 19th, 2013
Nanometrics Announces Participation in 5th Annual CEO Investor Summit: Accredited Investor and Publishing Research Analyst Event to be Held Concurrently With SEMICON West and Intersolar 2013 in San Francisco June 19th, 2013
Beneq’s comprehensive industrial Thin Film Coating Services shorten time to market June 18th, 2013
Which qubit my dear? New method to distinguish between neighbouring quantum bits June 18th, 2013