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Home > News > Freescale Forging Ahead to 45 nm in 2008

March 5th, 2008

Freescale Forging Ahead to 45 nm in 2008

Abstract:
Freescale Semiconductor Inc. (Austin, Texas) is skipping the 65 nm generation and moving directly from 90 to 45 nm design rules by the second half of this year for its networking chips, said Lisa Su, CTO.

As a member of the IBM-led Fishkill alliance since January 2007, Freescale is developing silicon on insulator (SOI) technology along with Advanced Micro Devices (AMD, Sunnyvale, Calif.) and IBM Corp. (Armonk, N.Y.)

Freescale manufactures its 90 nm SOI products at a 200 mm fab in Austin, but will move to foundries for 45 nm manufacturing starting with Chartered Semiconductor Manufacturing (Singapore). The Freescale products will use an oxynitride (non-high-k) gate oxide, she added.

Source:
semiconductor.net

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