Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > TechConnect Business Summit 2008 Offers Technology Matchmaking and Corporate Partnering Opportunities for Nanotech, Cleantech, and Life Sciences Secto

Abstract:
Co-Located with NSTI Nanotech and CSI Cleantech, Summit Is Now Accepting IP and Early Stage Company Submissions

TechConnect Business Summit 2008 Offers Technology Matchmaking and Corporate Partnering Opportunities for Nanotech, Cleantech, and Life Sciences Secto

Boston, MA | Posted on January 16th, 2008

TechConnect announced this week its call for technology intellectual property (IP), early stage company, and corporate needs presenters for its upcoming TechConnect Summit 2008, to be held June 1-5 at the Hynes Convention Center, Boston, MA, USA. The deadline to submit is February 1, 2008.

All submissions will be pre-screened by the 50+ member TechConnect Board, which includes representatives from BASF, Boston University, Honda, In-Q-Tel, Medtronic, Philips, Pfizer, Procter & Gamble, Sanyo, University of Washington, University of Wisconsin, Yale University, and many others. Accepted submissions will have the opportunity to present their technology or venture at the Summit, be featured prominently on the Summit web pages and program, and receive access to exclusive networking and matchmaking events.

To submit an IP, please visit www.techconnect.org/Summit2008/participate/IP/

To submit an Early Stage Company, please visit www.techconnect.org/Summit2008/participate/venture/

####

For more information, please click here

Copyright © NSTI

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

News and information

DNA triggers shape-shifting in hydrogels, opening a new way to make 'soft robots' September 21st, 2017

Physicists develop new recipes for design of fast single-photon gun Physicists develop high-speed single-photon sources for quantum computers of the future September 21st, 2017

GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology Platform: Technology solution delivers ‘connected intelligence’ to next generation high-volume wireless and IoT applications with lower power and significantly reduced cost September 20th, 2017

GLOBALFOUNDRIES Announces Availability of Embedded MRAM on Leading 22FDX® FD-SOI Platform: Advanced embedded non-volatile memory solution delivers ‘connected intelligence’ by expanding SoC capabilities on the 22nm process node September 20th, 2017

Announcements

DNA triggers shape-shifting in hydrogels, opening a new way to make 'soft robots' September 21st, 2017

Physicists develop new recipes for design of fast single-photon gun Physicists develop high-speed single-photon sources for quantum computers of the future September 21st, 2017

GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance Applications September 20th, 2017

Copper catalyst yields high efficiency CO2-to-fuels conversion: Berkeley Lab scientists discover critical role of nanoparticle transformation September 20th, 2017

Events/Classes

Leti Develops Proof of Concept to Test Wireless Systems in Aircraft: Will Present Results of Joint Project at AeroTech Conference And Exhibition in Fort Worth, Texas, Sept. 26-28 September 20th, 2017

Applications for the nanomedTAB are open until September 18th, 2017 September 13th, 2017

Arrowhead Pharmaceuticals to Host R&D Day on RNAi-Based Therapies September 1st, 2017

Silk could improve sensitivity, flexibility of wearable body sensors August 20th, 2017

Alliances/Trade associations/Partnerships/Distributorships

GLOBALFOUNDRIES and Soitec Enter Into Long-term Supply Agreement on FD-SOI Wafers: Strategic milestone to help guarantee a secure, high-volume supply of FD-SOI technology September 20th, 2017

GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications: Technology platforms are uniquely positioned to enable a new era of ‘connected intelligence’ with the transition to 5G September 20th, 2017

Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology for Highly Reliable Security and ID Applications: Ultra-high Resolution Pressure Sensing Uses Matrices of Vertical Piezoelectric Nanowire To Reconstruct the Smallest Features of Human Fingerprints September 5th, 2017

Phenom-World selects Deben to supply a tensile stage as an accessory to their range of desktop SEMs August 29th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project