- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
|The Applied FullVision CMP endpoint system is a major advancement over single wavelength endpoint technologies, offering twice the measurement accuracy with 50% higher reliability for dielectric applications, including oxide, STI and poly CMP. (Photo: Business Wire)|
Applied Materials, Inc. today announced its new Applied FullVision™ system that enables real-time control of dielectric CMP1 processes to the 45 nanometer (nm) device node and beyond. The FullVision system couples Applied's patented window-in-pad technology with multiple-wavelength spectroscopy to deliver advanced in situ endpoint capability for a variety of dielectric materials, including oxide, STI2, and poly CMP applications. The system demonstrates high repeatability across all applications with less than 150 angstrom, 3-sigma endpoint accuracy on patterned wafers. A major advance over single wavelength endpoint technologies, the FullVision system offers improved measurement accuracy with 50% higher reliability for dielectric applications.
"CMP endpoint technology was pioneered by Applied Materials and is key to delivering benchmark CMP performance," said Dr. Hichem M'Saad, vice president and general manager of Applied Materials' Dielectric Systems and CMP Business Group. "As films become thinner, CMP becomes increasingly difficult, requiring much more precise wafer-to-wafer process control to achieve acceptable yields. Using broadband spectral analysis, FullVision technology monitors individual polishing zones across the wafer to provide twice the accuracy and repeatability of competitive systems on a wide variety of process steps - without compromising throughput. These are vital requirements for advanced device manufacturing."
The FullVision system has already been adopted by major memory customers on their Applied Reflexion® LK CMP systems in high volume manufacturing. For these customers, the system has enabled higher CMP yield by significantly reducing wafer scrap caused by drifts in consumable sets and incoming wafer profile variations.
Applied Materials leads the industry in CMP technology — with an installed base of more than 900 300mm CMP systems worldwide — and in providing advanced in situ metrology for ensuring best-of-breed planarization performance. See http://appliedmaterials.com/products/reflexion_lk_cmp_4.html for more information on the Applied FullVision endpoint system.
1 CMP=chemical mechanical planarization
2 STI=shallow trench isolation
About Applied Materials, Inc.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in Nanomanufacturing Technology™ solutions with a broad portfolio of innovative equipment, service and software products for the fabrication of semiconductor chips, flat panel displays, solar photovoltaic cells, flexible electronics and energy efficient glass. At Applied Materials, we apply Nanomanufacturing Technology to improve the way people live.
For more information, please click here
Applied Materials, Inc.
408-986-7977 (financial community)
Copyright © Business Wire 2007If you have a comment, please Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
Quantum obstacle course changes material from superconductor to insulator December 1st, 2016
UTSA study describes new minimally invasive device to treat cancer and other illnesses: Medicine diffusion capsule could locally treat multiple ailments and diseases over several weeks December 3rd, 2016
Novel Electrode Structure Provides New Promise for Lithium-Sulfur Batteries December 3rd, 2016
Controlled electron pulses November 30th, 2016