- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
New conference presents strategies for brand owners to protect their products from counterfeiting, diversion and gray-market distribution, using the latest packaging-related technologies.
Summit Publishing Company announces the launch of a new conference for brand owners looking to enhance the security of their products using the latest packaging technologies. Produced by Summit Publishing Company's flagship magazine, Packaging World, the Brand-Protection Packaging Forum will take place on April 8, 2008 at the Chicago Marriott Schaumburg.
Encryption, DNA markers, taggants, microprint copy, holograms, item-level serialization, nanotechnology, and color-changing ink are just a few of the technologies being explored and implemented as brand owners around the world look for ways to ward off counterfeiting, diversion, and grey-market distribution. These illegal activities can erode and ultimately undo the brand value that marketers invest significant resources to maintain.
Via peer-to-peer education, the Brand-Protection Packaging Forum will educate brand owners about a variety of strategies to protect both the authenticity of products and the welfare of consumers. Presenters from the food, consumer electronics, cosmetic and pharmaceutical sectors are expected. Brand-Protection Packaging Forum will offer a full day of sessions for packaging professionals who are charged with maintaining and increasing the integrity of their products.
Packaging World Editor Pat Reynolds shares his thoughts. "In recent years, many brand protection and anti-counterfeiting initiatives have been focused on reactive, defensive strategies. Owners sought ways to prove the authenticity of their products - often times via forensic packaging technologies - in response to legal action. Increasingly, today's manufacturers are seeking more proactive, less litigious methods, many of which openly engage the consumer to confirm the authenticity of a product at the time of purchase or use."
"This conference offers an exciting opportunity to share new developments in a process that is top of mind for many brand owners. We believe the use of packaging technology as a means of protecting brands and consumers is an area that will see exceptional growth, as more and more companies add the issue of brand security to their business agenda," comments Packaging World Publisher Joe Angel.
Online registration for the Brand-Protection Packaging Forum is open now at http://www.packworld.com/bppf For additional information about attending or sponsoring this conference, please contact Events Manager Adriene Cooper at 312-222-1010.
About Summit Publishing Company
Chicago-based Summit Publishing Company is an integrated media publisher offering business information for packaging professionals. Print magazines include flagship monthly Packaging World ( http://www.packworld.com ); PACK EXPO Showcase; Healthcare Packaging and Contract Packaging. In addition to packaging e-newsletters, Summit Publishing Company also produces Webcasts and a variety of conferences for packaging professionals.
For more information, please click here
PACKAGING WORLD Magazine
Summit Publishing Company
330 N. Wabash Avenue, Suite 2401
Chicago, IL 60611
Copyright © PRWeb™If you have a comment, please Contact us.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
Law enforcement/Anti-Counterfeiting/Security/Loss prevention
Nanotech Grants Options September 22nd, 2016
NIST Patents Single-Photon Detector for Potential Encryption and Sensing Apps September 16th, 2016
Unusual quantum liquid on crystal surface could inspire future electronics October 22nd, 2016
Nanosciences: Genes on the rack October 21st, 2016
Nanoparticle vaccinates mice against dengue fever October 21st, 2016
Leti Scientists Participating in Sessions on Med Tech, Automotive Technologies, MEMS, Si-photonics and Lithography at SEMICON Europa: Teams also Will Demonstrate Technology Advances in Telecom, Data Fusion, Energy, Silicon Photonics and 3D Integration October 18th, 2016
MEMS & Sensors Industry Group Reveals Tech Showcase Finalists --MSIG hosts competition for unique MEMS/sensors demos at MEMS & Sensors Executive Congress, 11/10/16 in Scottsdale, AZ October 11th, 2016