Nanotechnology Now

Our NanoNews Digest Sponsors


Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Leading IC Engineers to Gather in Albany at SEMATECH Workshop on 3D Chips

Abstract:
An International SEMATECH-sponsored workshop will bring leading engineers here Oct. 11-12 to share insights on design and thermal challenges for next-generation, three-dimensional integrated circuits (3D ICs).

Leading IC Engineers to Gather in Albany at SEMATECH Workshop on 3D Chips

Albany, NY | Posted on September 24th, 2007

The meeting, "Thermal and Design Issues in 3D ICs," will explore the nature and magnitude of thermal challenges to 3D IC technology, which aims for greater functionality by stacking silicon chips connected with through-silicon vias (TSVs). The meeting at the Holiday Inn on Wolf Road also will address the broader architecture, design, and CAD tool challenges that must be met to exploit the full potential of 3D ICs.

"This approach has many potential advantages - improved electrical performance, lower power consumption, integration of different device types, and lower cost. However, it also presents many new challenges to the design community, including how to deal with higher power densities," said Larry Smith, SEMATECH engineer and workshop chair. "Our goal is to present a better understanding of these issues, and of the design methodologies and thermal management solutions that address them."

The workshop's program of leading 3D technologists and topics includes:

-- Overview of 3D Technologies, Thermal and Design Issues
-- Phil Garrou, Microelectronic Consultants of North Carolina,
"Introduction to 3D Technologies"
-- Mike Ignatowski, IBM, "Challenges and Opportunities for
Exploiting 3D Technology in System Designs"
-- Dr. Takafumi Fukushima, Tohoku University, "Thermal Issues of
3D ICs"
-- Applications, Opportunities, Program Scopes
-- John Magerlein, IBM, "Thermal Limits and Approaches for 3D
Chip Structures"
-- Bob Jones, Freescale, "Technology, Design and Applications of
3D Integration"
-- Muhannad Bakir, Georgia Tech, "Limits and Opportunities for
Heat Removal and Power Delivery to Gigascale Systems"
-- Michael Fritze, DARPA and Michael Steer, NCSU, "Thermal
Challenges in DARPA's 3DIC Technology Portfolio"
-- Modeling, Design, and Architecture
-- Ruchir Puri, IBM, "3D Design and CAD Challenges"
-- Yuan Xie, Penn State, "Design Space Exploration for 3D
Architectures"
-- Jason Cong, UCLA, "Thermal-Aware Physical Design for 3D ICs"
-- Thermal Characterization and Management
-- Darvin Edwards, Texas Instruments, "Thermal Management for Low
Cost Consumer Products"
-- Tan Chuan Seng, NTU-Singapore, "Heat Removal Enhancement of
3D Interconnects Using Copper Wafer Bonding"
-- Rajiv Joshi, IBM, "Thermal Analysis of Bonded Wafers"
-- Seri Lee, Nextreme, "Thermoelectric Cooling for 3D Chip Stacks"

The workshop is designed for IC manufacturers, materials suppliers, CAD suppliers and users, and 3D-TSV researchers, and is being held in conjunction with the Advanced Metallization Conference on Oct. 9-11 at the Albany Marriott Hotel. It is being co-sponsored by the ACM/SIGDA Physical Design Technical Committee. Interested persons are encouraged to visit the workshop website at http://www.sematech.org/meetings/announcements/8334/ .

####

About SEMATECH®
For 20 years, SEMATECH® ( http://www.sematech.org ) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Contacts:
SEMATECH, Austin
Dan McGowan
512-356-3440

Copyright © Business Wire 2007

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Gigantic ultrafast spin currents: Scientists from TU Wien (Vienna) are proposing a new method for creating extremely strong spin currents. They are essential for spintronics, a technology that could replace today's electronics May 25th, 2016

Diamonds closer to becoming ideal semiconductors: Researchers find new method for doping single crystals of diamond May 25th, 2016

Dartmouth team creates new method to control quantum systems May 24th, 2016

Attosecond physics: A switch for light-wave electronics May 24th, 2016

Announcements

Simple attraction: Researchers control protein release from nanoparticles without encapsulation: U of T Engineering discovery stands to improve reliability and fabrication process for treatments to conditions such as spinal cord damage and stroke May 28th, 2016

Scientists illuminate a hidden regulator in gene transcription: New super-resolution technique visualizes important role of short-lived enzyme clusters May 27th, 2016

Doubling down on Schrödinger's cat May 27th, 2016

Deep Space Industries and SFL selected to provide satellites for HawkEye 360’s Pathfinder mission: The privately-funded space-based global wireless signal monitoring system will be developed by Deep Space Industries and UTIAS Space Flight Laboratory May 26th, 2016

Events/Classes

Novel gene therapy shows potential for lung repair in asthma May 18th, 2016

Arrowhead Pharmaceuticals' Preclinical Candidate ARC-LPA Achieves 98% Knockdown and Long Duration of Effect after Subcutaneous Administration May 10th, 2016

Nanometrics Announces Upcoming Investor Events May 10th, 2016

Oxford Instruments Asylum Research and McGill University Announce the McGill AFM Summer School and Workshop, May 12-13, 2016 May 4th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic