Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Leading IC Engineers to Gather in Albany at SEMATECH Workshop on 3D Chips

An International SEMATECH-sponsored workshop will bring leading engineers here Oct. 11-12 to share insights on design and thermal challenges for next-generation, three-dimensional integrated circuits (3D ICs).

Leading IC Engineers to Gather in Albany at SEMATECH Workshop on 3D Chips

Albany, NY | Posted on September 24th, 2007

The meeting, "Thermal and Design Issues in 3D ICs," will explore the nature and magnitude of thermal challenges to 3D IC technology, which aims for greater functionality by stacking silicon chips connected with through-silicon vias (TSVs). The meeting at the Holiday Inn on Wolf Road also will address the broader architecture, design, and CAD tool challenges that must be met to exploit the full potential of 3D ICs.

"This approach has many potential advantages - improved electrical performance, lower power consumption, integration of different device types, and lower cost. However, it also presents many new challenges to the design community, including how to deal with higher power densities," said Larry Smith, SEMATECH engineer and workshop chair. "Our goal is to present a better understanding of these issues, and of the design methodologies and thermal management solutions that address them."

The workshop's program of leading 3D technologists and topics includes:

-- Overview of 3D Technologies, Thermal and Design Issues
-- Phil Garrou, Microelectronic Consultants of North Carolina,
"Introduction to 3D Technologies"
-- Mike Ignatowski, IBM, "Challenges and Opportunities for
Exploiting 3D Technology in System Designs"
-- Dr. Takafumi Fukushima, Tohoku University, "Thermal Issues of
3D ICs"
-- Applications, Opportunities, Program Scopes
-- John Magerlein, IBM, "Thermal Limits and Approaches for 3D
Chip Structures"
-- Bob Jones, Freescale, "Technology, Design and Applications of
3D Integration"
-- Muhannad Bakir, Georgia Tech, "Limits and Opportunities for
Heat Removal and Power Delivery to Gigascale Systems"
-- Michael Fritze, DARPA and Michael Steer, NCSU, "Thermal
Challenges in DARPA's 3DIC Technology Portfolio"
-- Modeling, Design, and Architecture
-- Ruchir Puri, IBM, "3D Design and CAD Challenges"
-- Yuan Xie, Penn State, "Design Space Exploration for 3D
-- Jason Cong, UCLA, "Thermal-Aware Physical Design for 3D ICs"
-- Thermal Characterization and Management
-- Darvin Edwards, Texas Instruments, "Thermal Management for Low
Cost Consumer Products"
-- Tan Chuan Seng, NTU-Singapore, "Heat Removal Enhancement of
3D Interconnects Using Copper Wafer Bonding"
-- Rajiv Joshi, IBM, "Thermal Analysis of Bonded Wafers"
-- Seri Lee, Nextreme, "Thermoelectric Cooling for 3D Chip Stacks"

The workshop is designed for IC manufacturers, materials suppliers, CAD suppliers and users, and 3D-TSV researchers, and is being held in conjunction with the Advanced Metallization Conference on Oct. 9-11 at the Albany Marriott Hotel. It is being co-sponsored by the ACM/SIGDA Physical Design Technical Committee. Interested persons are encouraged to visit the workshop website at .


For 20 years, SEMATECH® ( ) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

For more information, please click here

Dan McGowan

Copyright © Business Wire 2007

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

Nanoantenna lighting-rod effect produces fast optical switches October 24th, 2016

Unusual quantum liquid on crystal surface could inspire future electronics October 22nd, 2016

Scientists find technique to improve carbon superlattices for quantum electronic devices: In a paradigm shift from conventional electronic devices, exploiting the quantum properties of superlattices holds the promise of developing new technologies October 20th, 2016

Exploring defects in nanoscale devices for possible quantum computing applications October 19th, 2016


The quantum sniffer dog: A laser and detector in 1: A microscopic sensor has been developed at TU Wien, which can be used to identify different gases simultaneously October 25th, 2016

Hybrid nanostructures hold hydrogen well: Rice University scientists say boron nitride-graphene hybrid may be right for next-gen green cars October 25th, 2016

New nanomedicine approach aims to improve HIV drug therapies October 24th, 2016

New method increases energy density in lithium batteries: Novel technique may lead to longer battery life in portable electronics and electrical vehicles October 24th, 2016


KaSAM-2016: International Conference on Material Sciences has successfully concluded in Pokhara of Western Nepal October 24th, 2016

Leti Scientists Participating in Sessions on Med Tech, Automotive Technologies, MEMS, Si-photonics and Lithography at SEMICON Europa: Teams also Will Demonstrate Technology Advances in Telecom, Data Fusion, Energy, Silicon Photonics and 3D Integration October 18th, 2016

The University of Applied Sciences in Upper Austria uses Deben tensile stages as an integral part of their computed tomography research and testing facility October 18th, 2016

Pokhara (Nepal) all set to host KaSAM-2016: An International Scientific Meeting on Advanced Materials October 15th, 2016

The latest news from around the world, FREE

  Premium Products
Only the news you want to read!
 Learn More
University Technology Transfer & Patents
 Learn More
Full-service, expert consulting
 Learn More

Nanotechnology Now Featured Books


The Hunger Project