Home > Press > Leading IC Engineers to Gather in Albany at SEMATECH Workshop on 3D Chips
An International SEMATECH-sponsored workshop will bring leading engineers here Oct. 11-12 to share insights on design and thermal challenges for next-generation, three-dimensional integrated circuits (3D ICs).
Leading IC Engineers to Gather in Albany at SEMATECH Workshop on 3D Chips
Albany, NY | Posted on September 24th, 2007
The meeting, "Thermal and Design Issues in 3D ICs," will explore the nature and magnitude of thermal challenges to 3D IC technology, which aims for greater functionality by stacking silicon chips connected with through-silicon vias (TSVs). The meeting at the Holiday Inn on Wolf Road also will address the broader architecture, design, and CAD tool challenges that must be met to exploit the full potential of 3D ICs.
"This approach has many potential advantages - improved electrical performance, lower power consumption, integration of different device types, and lower cost. However, it also presents many new challenges to the design community, including how to deal with higher power densities," said Larry Smith, SEMATECH engineer and workshop chair. "Our goal is to present a better understanding of these issues, and of the design methodologies and thermal management solutions that address them."
The workshop's program of leading 3D technologists and topics includes:
-- Overview of 3D Technologies, Thermal and Design Issues
-- Phil Garrou, Microelectronic Consultants of North Carolina,
"Introduction to 3D Technologies"
-- Mike Ignatowski, IBM, "Challenges and Opportunities for
Exploiting 3D Technology in System Designs"
-- Dr. Takafumi Fukushima, Tohoku University, "Thermal Issues of
-- Applications, Opportunities, Program Scopes
-- John Magerlein, IBM, "Thermal Limits and Approaches for 3D
-- Bob Jones, Freescale, "Technology, Design and Applications of
-- Muhannad Bakir, Georgia Tech, "Limits and Opportunities for
Heat Removal and Power Delivery to Gigascale Systems"
-- Michael Fritze, DARPA and Michael Steer, NCSU, "Thermal
Challenges in DARPA's 3DIC Technology Portfolio"
-- Modeling, Design, and Architecture
-- Ruchir Puri, IBM, "3D Design and CAD Challenges"
-- Yuan Xie, Penn State, "Design Space Exploration for 3D
-- Jason Cong, UCLA, "Thermal-Aware Physical Design for 3D ICs"
-- Thermal Characterization and Management
-- Darvin Edwards, Texas Instruments, "Thermal Management for Low
Cost Consumer Products"
-- Tan Chuan Seng, NTU-Singapore, "Heat Removal Enhancement of
3D Interconnects Using Copper Wafer Bonding"
-- Rajiv Joshi, IBM, "Thermal Analysis of Bonded Wafers"
-- Seri Lee, Nextreme, "Thermoelectric Cooling for 3D Chip Stacks"
The workshop is designed for IC manufacturers, materials suppliers, CAD suppliers and users, and 3D-TSV researchers, and is being held in conjunction with the Advanced Metallization Conference on Oct. 9-11 at the Albany Marriott Hotel. It is being co-sponsored by the ACM/SIGDA Physical Design Technical Committee. Interested persons are encouraged to visit the workshop website at http://www.sematech.org/meetings/announcements/8334/ .
For 20 years, SEMATECH® ( http://www.sematech.org ) has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.
For more information, please click here
Copyright © Business Wire 2007
If you have a comment, please Contact
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
Sussex physicists find simple solution for quantum technology challenge October 28th, 2014
Watching the hidden life of materials: Ultrafast electron diffraction experiments open a new window on the microscopic world October 27th, 2014
Breakthrough in molecular electronics paves the way for DNA-based computer circuits in the future: DNA-based programmable circuits could be more sophisticated, cheaper and simpler to make October 27th, 2014
QuantumWise guides the semiconductor industry towards the atomic scale October 24th, 2014
Nano Ruffles in Brain Matter: Freiburg researchers decipher the role of nanostructures around brain cells in central nervous system function October 31st, 2014
Gold nanoparticle chains confine light to the nanoscale October 31st, 2014
'Nanomotor lithography' answers call for affordable, simpler device manufacturing October 31st, 2014
Device invented at Johns Hopkins provides up-close look at cancer on the move: Microscopic view of metastasis could give insight about how to keep cancer in check October 31st, 2014
New Compact SIMS at 61st AVS | Visit us on Booth 311 October 28th, 2014
Iran to Hold 3rd Int'l Engineering Materials, Metallurgy Conference October 25th, 2014
Iran-Made Respiratory Nano Masks Provided to Hajj Pilgrims October 23rd, 2014
MEMS & Sensors Technology Showcase: Finalists Announced for MEMS Executive Congress US 2014 October 23rd, 2014