Nanotechnology Now





Heifer International

Wikipedia Affiliate Button


DHgate

Home > Press > Soitec and the French Agency for Industrial Innovation (AII) Announce the European Commission Approval for the Funding of the Strategic R&D Program, N

Abstract:
Soitec (Euronext Paris), the world's leading supplier of silicon-on-insulator (SOI) wafers and other engineered substrates, and the French Agency for Industrial Innovation today announced the European Commission's authorization for the funding of the strategic R&D program, NanoSmart. The total cost of the program, for all partners, comes to 200 million Euros over five years. The Soitec Group will receive public money amounting to 62 million Euros, with 34 million Euros consisting of a direct subsidy, and 28 million Euros representing an advance to be refunded-depending on the program's commercial success.

Soitec and the French Agency for Industrial Innovation (AII) Announce the European Commission Approval for the Funding of the Strategic R&D Program, N

BERNIN, France | Posted on September 14th, 2007

This ambitious R&D project will involve Soitec, its subsidiary Picogiga, based in Les Ulis, France, and Leti (the electronic and information technology laboratory), part of the public French body CEA. NanoSmart is a strategic program for Europe, and will develop advanced substrates for microelectronic and optoelectronic components, spotlighting the significant role played in substrate engineering innovation, not only by France but more specifically by Bernin and Minalogic, the "Pole de Competitivite" near Grenoble.

As a nanotechnology research platform, NanoSmart will develop a new generation of advanced materials to improve the performance and electrical consumption of image processors, high-frequency telecommunications components, power components for the automotive industry and home audiovisual equipment and LEDs for lighting.

"We are very pleased to have received the European Commission's approval for this ambitious and strategic program, not only for Soitec, but also for France and Europe. Advanced substrates represent a unique opportunity to strengthen Europe's position in the high-tech industry, where competitiveness is based on innovation," said Andre-Jacques Auberton-Herve, president and chief executive officer of Soitec. "We are grateful to AII for its support and policy of promoting innovation in companies of our size, alongside the large French industrial groups."

AII wanted to support Soitec in its new innovation cycle, using technological breakthroughs shaping the markets of the future. They also wanted to drive this French growth company to the level of the world's substrate leaders. This action answers AII's core business mission by sustaining the French industry through promoting innovation and significant projects.

This program is an integral part of the Soitec Group's strategic development plan for 2006-2010, unveiled on July 6, 2006. Soitec intends to boost R&D at Bernin over this period to allow the NanoSmart program to benefit from the presence of the production teams in view of industrial deployment.

This partnership will help the circulation of knowledge in all domains of nanotechnologies both for European and worldwide research.

####

About Soitec
The Soitec Group is the world's leading innovator and provider of the engineered substrate solutions that serve as the foundation for today's most advanced microelectronic products. The group leverages its proprietary Smart Cut(TM) technology to engineer new substrate solutions, such as silicon-on-insulator (SOI) wafers, which became the first high-volume application for this proprietary technology. Since then, SOI has emerged as the material platform of the future, enabling the production of higher performing, faster chips that consume less power.

Today, Soitec produces more than 80 percent of the world's SOI wafers. Headquartered in Bernin, France, with two high-volume fabs on-site, Soitec has offices throughout the United States, Japan and Taiwan, along with a new manufacturing site under construction in Singapore.

Two other divisions, Picogiga International (Les Ulis) and Tracit Technologies (Bernin), complete the Soitec Group. Picogiga focuses on delivering advanced substrates solutions, including III-Vs epiwafers and gallium nitride (GaN)-based wafers, to the compound material world for the manufacture of high-frequency electronics and other optoelectronic devices. Tracit, on the other hand, focuses on thin-film layer transfer technologies used to manufacture advanced substrates for power ICs and microsystems, as well as generic circuit transfer technology for applications such as image sensors and 3D-integration. Both shares and convertible bonds for the Soitec Group are listed on Euronext Paris. For more information, visit http://www.soitec.com/ .

Soitec, Smart Cut and UNIBOND are trademarks of S.O.I.TEC Silicon On Insulator Technologies

For more information, please click here

Contacts:
S.O.I.TEC Silicon On Insulator Technologies (Head Office)
Parc Technologique des Fontaines
38190 Bernin
France
Phone: +33 (0)4 76 92 75 00
Fax: +33 (0)4 38 92 17 89
e-mail:

Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Display technology/LEDs/SS Lighting/OLEDs

New technology using silver may hold key to electronics advances July 2nd, 2015

Philips Introduces Quantum Dot TV with Color IQ™ Technology from QD Vision: Manufacturer is first to offer quantum dot displays for both TVs and monitors June 30th, 2015

Graphene flexes its electronic muscles: Rice-led researchers calculate electrical properties of carbon cones, other shapes June 30th, 2015

The peaks and valleys of silicon: Team of USC Viterbi School of Engineering Researchers introduce new layered semiconducting materials as silicon alternative June 27th, 2015

Govt.-Legislation/Regulation/Funding/Policy

New technology using silver may hold key to electronics advances July 2nd, 2015

NIST Group Maps Distribution of Carbon Nanotubes in Composite Materials July 2nd, 2015

NIST ‘How-To’ Website Documents Procedures for Nano-EHS Research and Testing July 1st, 2015

Ultra-stable JILA microscopy technique tracks tiny objects for hours July 1st, 2015

Chip Technology

Nanometrics to Announce Second Quarter Financial Results on July 23, 2015 July 2nd, 2015

The quantum middle man July 2nd, 2015

New technology using silver may hold key to electronics advances July 2nd, 2015

Emergence of a 'devil's staircase' in a spin-valve system July 1st, 2015

Announcements

Clues to inner atomic life from subtle light-emission shifts: Hyperfine structure of light absorption by short-lived cadmium atom isotopes reveals characteristics of the nucleus that matter for high precision detection methods July 3rd, 2015

Pioneering Southampton scientist awarded prestigious physics medal July 3rd, 2015

Groundbreaking research to help control liquids at micro and nano scales July 3rd, 2015

NIST Group Maps Distribution of Carbon Nanotubes in Composite Materials July 2nd, 2015

Automotive/Transportation

June 29th, 2015

Buckle up for fast ionic conduction June 16th, 2015

A protective shield for sensitive catalysts: Hydrogels block harmful oxygen June 15th, 2015

Slip sliding away: Graphene and diamonds prove a slippery combination June 10th, 2015

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More










ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project