Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > SUSS MicroTec and STS Take MEMS Technology Roadshow to Europe

SUSS MicroTec and Surface Technology Systems, two of the leading providers for MEMS manufacturing solutions worldwide, announced today that the successful "MEMS Roadshow", which toured 5 cities in the US earlier this year, will now travel to Europe.

SUSS MicroTec and STS Take MEMS Technology Roadshow to Europe

NEWPORT, UK | Posted on September 4th, 2007

"MEMS Technology: Embracing the Future" will include presentations on the latest critical manufacturing processes in MEMS today. Talks will cover high aspect ratio lithography and plasma etching, wafer bonding, dry release processing and wafer level test. In addition, speakers will discuss the key manufacturing issues critical for advanced MEMS device fabrication today. SUSS and STS have invited representatives from Primaxx, Inc. and XACTIX, Inc. to join the roadshow, creating a unique opportunity to listen to industry experts cover most of the key MEMS technologies used today.

John Saunders, CEO of STS explained, "We are very excited to have the opportunity to co-host this roadshow again and share our experience and vision for the future of MEMS manufacturing with a new audience. We believe the topics presented at the Roadshow will be of great interest to participants in Europe where the MEMS/MST industry is particularly strong."

"STS and SUSS MicroTec combine all critical process steps in MEMS and MEMS Packaging", said Rolf Wolf, Managing Director of SUSS MicroTec Lithography division. "As MEMS is increasingly transferring new products into production, we believe this roadshow offers a unique platform for our customers to learn more about the latest trends in MEMS manufacturing"

The "MEMS Technology: Embracing the Future" roadshow will begin in Grenoble (F) on September 24 and move onto Eindhoven (NL) and Copenhagen (DK). Presenters will provide an overview of the leading-edge technologies currently available to support the most advanced MEMS processes. More detailed information is available at .


About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders, probe systems and now equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit .

About Surface Technology Systems plc

STS designs and manufactures a range of highly specialized systems incorporating innovative technology used in the production of semiconductors and related devices and is a leader in plasma based etch and deposition technologies for processing non 'mainstream' semiconductor devices. STS serves a range of applications in several emerging sectors within the telecommunications, data storage, advanced packaging, MEMS and Nanotechnology.

STS is the market leader in deep silicon etching for the growing MEMS market, offering patent-protected technology. In addition, STS has a strong presence in each of its other served markets and distributes its process solutions worldwide through an experienced sales and service operation. The Group currently markets in over 30 countries and has an installed base of over 900 systems. For more information about STS please see

All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.

For more information, please click here


Copyright © PR Newswire Association LLC.

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press


Leti Scientists Participating in Sessions on Med Tech, Automotive Technologies, MEMS, Si-photonics and Lithography at SEMICON Europa: Teams also Will Demonstrate Technology Advances in Telecom, Data Fusion, Energy, Silicon Photonics and 3D Integration October 18th, 2016

MEMS & Sensors Industry Group Reveals Tech Showcase Finalists --MSIG hosts competition for unique MEMS/sensors demos at MEMS & Sensors Executive Congress, 11/10/16 in Scottsdale, AZ October 11th, 2016

Manufacturing microspheres: Technique mass-produces uniform, encapsulated particles for pharmaceuticals, many other uses October 6th, 2016

Leti and Taiwanese Tech Organizations Sponsoring Workshop in Taipei on MEMS, IoT, Smart Lighting Applications, System Reliability & Security September 28th, 2016


Metamaterial device allows chameleon-like behavior in the infrared October 28th, 2016

A Tiny Machine: UCSB electrical and computer engineers design an infinitesimal computing device October 28th, 2016

The molecular mechanism that blocks membrane receptors has been identified: The work in which the Ikerbasque researcher of the Biofisika Institute Xabier Contreras has participated has been published in the journal Cell October 27th, 2016

Imaging where cancer drugs go in the body could improve treatment October 26th, 2016


KaSAM-2016: International Conference on Material Sciences has successfully concluded in Pokhara of Western Nepal October 24th, 2016

Leti Scientists Participating in Sessions on Med Tech, Automotive Technologies, MEMS, Si-photonics and Lithography at SEMICON Europa: Teams also Will Demonstrate Technology Advances in Telecom, Data Fusion, Energy, Silicon Photonics and 3D Integration October 18th, 2016

The University of Applied Sciences in Upper Austria uses Deben tensile stages as an integral part of their computed tomography research and testing facility October 18th, 2016

Pokhara (Nepal) all set to host KaSAM-2016: An International Scientific Meeting on Advanced Materials October 15th, 2016

The latest news from around the world, FREE

  Premium Products
Only the news you want to read!
 Learn More
University Technology Transfer & Patents
 Learn More
Full-service, expert consulting
 Learn More

Nanotechnology Now Featured Books


The Hunger Project