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Home > News > NEW WORLDS: Better bonding

June 23rd, 2007

NEW WORLDS: Better bonding

Abstract:
Scientists at the Technion-Israel Institute of Technology and colleagues in New York have found an original way to improve bonding between materials. The importance of this discovery to microelectronics devices translates into improved performance and reliability. In addition, this discovery could be used in nanometric devices that contain organic molecules and need to withstand high temperatures.

Prof. Moshe Eizenberg of the materials engineering department and the Russell Berrie Nanotechnology Institute, together with Prof. Ganapathiraman Ramanath of the Rensselaer Polytechnic Institute in Troy, New York, published in Nature their work on bonding and adhering materials using nanolayers. These are short organic chains, each containing groups of atoms that bond to the appropriate surface.

Source:
jpost.com

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