- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
June 23rd, 2007
Scientists at the Technion-Israel Institute of Technology and colleagues in New York have found an original way to improve bonding between materials. The importance of this discovery to microelectronics devices translates into improved performance and reliability. In addition, this discovery could be used in nanometric devices that contain organic molecules and need to withstand high temperatures.
Prof. Moshe Eizenberg of the materials engineering department and the Russell Berrie Nanotechnology Institute, together with Prof. Ganapathiraman Ramanath of the Rensselaer Polytechnic Institute in Troy, New York, published in Nature their work on bonding and adhering materials using nanolayers. These are short organic chains, each containing groups of atoms that bond to the appropriate surface.
|Related News Press|
Animal study shows flexible, dissolvable silicon device promising for brain monitoring: Other applications include post-operative observation for vascular, cardiac, and orthopaedic procedures, finds Penn study May 5th, 2016
Exploring phosphorene, a promising new material April 29th, 2016
Nanoparticles present sustainable way to grow food crops May 1st, 2016
The intermediates in a chemical reaction photographed 'red-handed' Researchers at the UPV/EHU-University of the Basque Country have for the first time succeeded in imaging all the steps in a complex organic reaction and have resolved the mechanisms that explain it May 4th, 2016
Cooling graphene-based film close to pilot-scale production April 30th, 2016