Home > Press > FEI introduces Expida - advanced wafer DualBeamT with S/TEM
Expida™ 1255S Delivers Ultra-High-Resolution Analysis for Multiple Wafer Samples with High Throughput and Single System Simplicity
FEI introduces Expida - advanced wafer DualBeamT with S/TEM
HILLSBORO, OR | Posted on June 11th, 2007
Following the success of its popular Expida™ 1255 wafer DualBeam™ system for semiconductor labs, FEI Company (Nasdaq: FEIC) has introduced the next-generation tool in the product family, the Expida 1255S. It is the first, and only, wafer DualBeam system to integrate wafer level STEM (scanning/transmission electron microscopy) sample preparation with ultra-high-resolution imaging and analysis in a single tool. The Expida 1255S features an advanced ion beam column for preparing TEM samples, and an enhanced electron column with a 14-segment STEM detector for high-resolution 30kV imaging.
Until now, advanced sample preparation and handling often caused frustrating delays and required the use of multiple systems and processes to create high-quality TEM samples. The Expida 1255S assures correct end-pointing and precise lamella thickness by enabling STEM imaging while milling the TEM sample to its final location and required thickness.
The new Expida system uniquely addresses the requirements of high-throughput STEM imaging and analysis for sub-45 nanometer process control. With its speed, accuracy and integrated operation, the Expida 1255S delivers complete sets of data faster, and ultimately delivers faster time to market and a faster ramp to volume production.
"Semiconductor labs supporting process control for volume manufacturing have often been caught in a bind," explains Tony Edwards, vice president of FEI's NanoElectronics market division. "Time-efficient SEM tools lacked the necessary magnification and resolutions for today's device designs while higher-resolution STEM and TEM systems required time-consuming sample preparation. FEI's innovations in DualBeam and electron microscopy have enabled us to deliver this faster and simpler solution for semiconductor manufacturers."
The new Expida 1255S STEM along with FEI's entire suite of time- and cost-saving solutions for semiconductor manufacturers will be featured at SEMICON West, July 17-19, (Booth 2120, South Hall) at San Francisco's Moscone Center.
About FEI Company
FEI (Nasdaq: FEIC) is a global leader in providing innovative instruments for nanoscale imaging, analysis and prototyping. FEI focuses on delivering solutions that provide groundbreaking results and accelerate research, development and manufacturing cycles for its customers in Semiconductor and Data Storage, Academic and Industrial R&D, and Life Sciences markets. With R&D centers in North America and Europe, and sales and service operations in more than 50 countries around the world, FEI’s Tools for Nanotech™ are bringing the nanoscale within the grasp of leading researchers and manufacturers. More information can be found online at http://www.fei.com .
This news release contains forward-looking statements about a new DualBeam product and its capabilities and possible benefits. Factors that could affect these forward-looking statements include but are not limited to delays in the roll-out of the product, manufacturing or delivery delays and failure of the product to perform as expected due to technical or other reasons. Please also refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update forward-looking statements.
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Dan Zenka, APR
Global Public Relations
+1 503 726 2695
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