Home > Press > Dongbu Electronics Announces RF Process Design Kit Developed With Support of Cadence Design Systems
New PDK Facilitates Implementation of Advanced RF Chip Solutions at the 130nm Node and Supports Applications Operating Up 30 GHz
Dongbu Electronics Announces RF Process Design Kit Developed With Support of Cadence Design Systems
SEOUL, South Korea | Posted on April 3rd, 2007
Dongbu Electronics today introduced an RF Process Design Kit (PDK) that it developed with the assistance of Cadence Design Systems, Inc. (NASDAQ:CDNS). Immediately available at no charge to Dongbu customers, the new PDK streamlines the implementation of RF chip solutions at the 130nm node as it supports applications up to 30GHz.
While most Korean companies currently import RF ICs to manufacture wireless products, Dongbu is committed to creating a reliable environment for manufacturing RF CMOS chips within Korea. "We aim to further enhance our country's well-established semiconductor-manufacturing infrastructure," said Dr. Jae Song, EVP for Dongbu Electronics. "Providing PDKs for specialty processes such as RF CMOS Chips is just one example of how we aim to reach this goal. We are confident that the PDK introduced today will enable fabless companies to sharply reduce RF product design costs and time-to-volume production."
Dr. Song noted that Dongbu began working with Cadence to develop PDKs more than two years ago, at which time Dongbu developed with assistance from Cadence a PDK to speed the design of analog functions for CMOS mixed-signal chips. "We continue to work effectively with Cadence to expand our PDK portfolio," he added.
According to iSuppli, the worldwide market for RF components used in cellular/PCS handsets is forecast to exceed US$7.4 billion in 2010, up from approximately US$6.4 billion in 2005. Currently North American companies are leading RF semiconductor manufacturing with 54 percent market share, followed by the European firms with 28 percent and Asian companies with 17 percent.
The RF chips supported by Dongbu's new PDK chips are well suited to serve a mobile, satellite and optical communications as well as other wired/wireless applications.
About Dongbu Electronics
Dongbu Electronics provides world-class CMOS processing for system-on-chip solutions that integrate advanced logic, analog, and mixed-signal technologies. As a “Specialty Solution Partner” in high-growth markets, such as those represented by mobile handsets and flat-panel displays, Dongbu adds high value with specialized processing for CMOS Image Sensor (CIS), High Voltage, Flash, and LCD Driver IC (LDI) functions. Dongbu’s collaborate-and-thrive approach is evident across the entire manufacturing spectrum including prototype development/verification, packaging/module development, complete turnkey solutions, and accelerating time to volume production. The company’s stock is publicly traded under 001830 on the Korea Stock Exchange. For more information, visit http://www.dongbuelec.com .
Note to Editors:
Dongbu Electronics and Dongbu Hannong Chemicals, both publicly held Korean companies that operate within The Dongbu Group, recently announced that their respective shareholders have agreed to a merger, effective May 1, 2007. To be called “Dongbu HiTek”, this synergistic union is expected to create a world class enterprise that is focused on bio and semiconductor industries to provide comprehensive foundry services as well as advanced chemicals and materials, including those used in bioengineering, nanotechnology and semiconductor processing.
For more information, please click here
Dongbu Electronics Korea/Asia
Kevin Lee, +82.17.337.4698
Dongbu Electronics USA/ Europe
Elizabeth Estrella-Basilio, +1.408.238.8822
Copyright © Business Wire 2007
If you have a comment, please Contact
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
State-of-the-art online system unveiled to pinpoint metrology software accuracy March 27th, 2015
SUNY POLY CNSE to Host First Ever Northeast Semi Supply Conference (NESCO) Conference Will Connect New and Emerging Innovators in the Northeastern US and Canada with Industry Leaders and Strategic Investors to Discuss Future Growth Opportunities in NYS March 25th, 2015
NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015
Building shape inspires new material discovery March 24th, 2015
A first glimpse inside a macroscopic quantum state March 28th, 2015
DFG to Establish One Clinical Research Unit and Five Research Units: New Projects to Investigate Complications in Pregnancy, Particle Physics, Nanoparticles, Implants and Transport Planning / Approximately 13 Million Euros in Funding for an Initial Three-Year Period March 28th, 2015
Designer's toolkit for dynamic DNA nanomachines: Arm-waving nanorobot signals new flexibility in DNA origami March 27th, 2015
Using magnetic fields to understand high-temperature superconductivity: Los Alamos explores experimental path to potential 'next theory of superconductivity' March 27th, 2015