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Home > Press > STS Lands Pegasus Order From Fraunhofer IZM

Surface Technology Systems plc(STS) today announced that they have won an EU tender for an MPX Pegasus
system from the Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration IZM, Munich part of the institute.

STS Lands Pegasus Order From Fraunhofer IZM

NEWPORT, Wales, UK | Posted on January 22nd, 2007

Fraunhofer IZM is one of the leading institutes in the fields of system integration technologies, materials and reliability, wafer level integration and system design and sustainable development, and has close ties to many large European semiconductor manufacturers. This STS Pegasus system will be utilized for industrial research and development into advanced packaging.

Commenting on the purchase of the Pegasus system, Robert Wieland of Fraunhofer IZM in Munich said: "We have selected the STS' Pegasus system because of the unique plasma source design and the ease of use of the system itself. Pegasus has demonstrated that it not only offers etch rates higher than competing systems but also higher mask selectivity and superior profile control."

John Saunders, CEO of STS added: "We are delighted to place a tool with such an influential knowledge centre, such as Fraunhofer IZM. Processing solutions developed on 200mm wafers for advanced packaging applications are likely to require easy transfer to 300mm wafers commonly used in mainstream IC packaging, so our new 300mm deep DRIE source, the development of which we announced in September 2006, is a key advantage as we establish ourselves as a key production equipment supplier to this industry sector."


About STS
STS designs and manufactures a range of highly specialized systems incorporating innovative technology used in the production of semiconductors and related devices and is a leader in plasma based etch and deposition technologies for processing non 'mainstream' semiconductor devices. STS serves a range of applications in several emerging sectors within the telecommunications, data storage, advanced packaging, MEMS and Nanotechnology.

STS is the market leader in deep silicon etching for the growing MEMS market, offering patent-protected technology. In addition, STS has a strong presence in each of its other served markets and distributes its process solutions worldwide through an experienced sales and service operation. The Group currently markets in over 30 countries and has an installed base of over 900 systems.

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