Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > NXP Semiconductors and TSMC Strengthen R&D Cooperation and Manufacturing Partnership

Abstract:
NXP, the independent semiconductor company founded by Philips, and Taiwan Semiconductor Manufacturing Company Limited (TSMC) today announced they will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as manufacturing partnership. NXP is a global leader in semiconductor solutions for mobile phones, personal media players, TVs, set-top boxes, identification applications, cars and a wide range of other electronic devices; TSMC is the world's largest dedicated semiconductor foundry, with proven world-class CMOS manufacturing and leading process R&D capabilities.

NXP Semiconductors and TSMC Strengthen R&D Cooperation and Manufacturing Partnership

EINDHOVEN, Netherlands & HSINCHU, Taiwan | Posted on January 16th, 2007

"We've chosen to strengthen our cooperation with TSMC, in the area of advanced CMOS development," stated Frans van Houten, NXP President and Chief Executive Officer. "This move will enable NXP to concentrate more on creating innovative, differentiating process options, such as embedded non-volatile technology in 45nm for our state of the art System-on-Chip products, while building on the process platform from TSMC. It underlines our commitment to be a leader in advanced CMOS system chips."

"With our strengths of technology leadership, manufacturing excellence, and customer partnership, TSMC has become a strategic partner for many global customers with whom we have forged a powerful competitive force in the semiconductor industry. This agreement with NXP Semiconductors represents an extension of the long-term, strategic and fruitful alliance between the two companies. The synergy between these two global technology leaders will achieve new milestones in the foreseeable future," stated Dr. Rick Tsai, president and Chief Executive Officer of TSMC.

The strengthened global R&D cooperation will be built upon the existing NXP Research organization at the IMEC facilities in Leuven, Belgium, and TSMC corporate R&D in Hsinchu, Taiwan. It leverages the R&D talent and infrastructures of both companies in the area of IP, design, modeling, materials, and process technologies. NXP has a fruitful cooperation with IMEC, Europe's leading independent research center in the field of micro- and nanoelectronics and nanotechnology. TSMC is also a core member of IMEC. The joint research effort will enable NXP to do proprietary development based on TSMC platform technology. This strengthened cooperation will also allow TSMC to further expand its research activities in Europe.

####

About NXP
NXP is a top 10 semiconductor company founded by Philips, more than 50 years ago. Headquartered in the Netherlands, the company has 37,000 employees working in 20 countries across the world. NXP creates semiconductors, system solutions and software that deliver better sensory experiences in mobile phones, personal media players, TVs, set-top boxes, identification applications, cars and a wide range of other electronic devices. News from NXP is located at www.nxp.com.

About TSMC

TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry industry’s largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total installed capacity in 2006 will exceed seven million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs, four eight-inch fabs, and one six-inch fab. TSMC also has substantial capacity commitments at its wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 65nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com .

For more information, please click here

Contacts:
NXP
Paul Morrison, +1 408-474-5065 (USA)

Heather Drake, +31 40 27 65949 (Europe)

Terry Chiang, +886 2 3789 2821 (Greater China)

Mark Chisholm, +81 3 3740 4792 (Japan)

or
TSMC
JH Tzeng, +886 3 505 5028
Mobile: +886 928 882 607

Copyright © Business Wire

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related Links

NXP

TSMC

Related News Press

Chip Technology

Physicists develop new recipes for design of fast single-photon gun Physicists develop high-speed single-photon sources for quantum computers of the future September 21st, 2017

GLOBALFOUNDRIES and Soitec Enter Into Long-term Supply Agreement on FD-SOI Wafers: Strategic milestone to help guarantee a secure, high-volume supply of FD-SOI technology September 20th, 2017

GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology Platform: Technology solution delivers ‘connected intelligence’ to next generation high-volume wireless and IoT applications with lower power and significantly reduced cost September 20th, 2017

GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems: Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI September 20th, 2017

Nanoelectronics

GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance Applications September 20th, 2017

Bit data goes anti-skyrmions September 1st, 2017

Ames Laboratory scientists move graphene closer to transistor applications August 30th, 2017

GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud Applications: Solution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system August 9th, 2017

Announcements

Physicists develop new recipes for design of fast single-photon gun Physicists develop high-speed single-photon sources for quantum computers of the future September 21st, 2017

GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM Systems: Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI September 20th, 2017

GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance Applications September 20th, 2017

Copper catalyst yields high efficiency CO2-to-fuels conversion: Berkeley Lab scientists discover critical role of nanoparticle transformation September 20th, 2017

Alliances/Trade associations/Partnerships/Distributorships

GLOBALFOUNDRIES and Soitec Enter Into Long-term Supply Agreement on FD-SOI Wafers: Strategic milestone to help guarantee a secure, high-volume supply of FD-SOI technology September 20th, 2017

GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G Applications: Technology platforms are uniquely positioned to enable a new era of ‘connected intelligence’ with the transition to 5G September 20th, 2017

Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology for Highly Reliable Security and ID Applications: Ultra-high Resolution Pressure Sensing Uses Matrices of Vertical Piezoelectric Nanowire To Reconstruct the Smallest Features of Human Fingerprints September 5th, 2017

Phenom-World selects Deben to supply a tensile stage as an accessory to their range of desktop SEMs August 29th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project