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Home > News > Canadian NanoFab installing SUSS wafer bonder

November 22nd, 2006

Canadian NanoFab installing SUSS wafer bonder

Abstract:
SUSS MicroTec, the Munich, Germany-based supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced that the University of Alberta's NanoFab has selected its new ELAN CB6L wafer bonding equipment for its research and production activities.

Source:
smalltimes.com

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