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July 14th, 2006
Semiconductors: How Small Can They Go?
From the floor of the SEMICON West expo in San Francisco, companies looking to produce the next generation of chips for future digital devices confront new technological and business challenges.
The tracks of the conference could be found in four stages located in corners of the show floor. The divisions were emerging technologies (such as nanotech and MEMS); testing and assembly/packaging issues; best practices in manufacturing productivity and effectiveness; and challenges in scaling devices to 45nm and 32nm.
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