Nanotechnology Now

• About Us
  
  • Advertising
  • Our Mission
  • Our Team
  • Comments
  • Friends
  • Contact
• Nanotechnology
• News
  
  • Current News
  • Press Releases
  • Submit Press
  • Press kit
  • Interviews
• Columns
• Products
  
  • Our Products
  • Books
  • Featured Books
• Directories
  
  • Companies/Academic
  • Events
  • Glossary
  • Best Of
• Career Center
• Nano-Social Network
• Nano Consulting
• My Account

Home > News > Fiction Becomes Fact at IBM

June 21st, 2006

Fiction Becomes Fact at IBM

Abstract:
Jack Uldrich: IBM (NYSE: IBM) researchers announced today that they have broken the speed record for silicon-based chips. The researchers were able to rev them up to 500 gigahertz -- 250 times faster than the fastest chips in today's cell phones -- by pushing the new chips to minus-451 to keep them from melting under such high speeds.

As impressive as this is, what's even more impressive is that the chips can still operate at an amazing 350 GHz at room temperature. This speed, combined with the fact that IBM can reportedly build the chip using typical semiconductor manufacturing technology, suggests that these new chips may find their way into homes and offices with the next 18 to 24 months.

Source:
fool.com

Bookmark:

Related News Press

Investments/IPO's/Splits

Aspen Aerogels Announces $22.5 Million Private Placement May 18th, 2013

Harris & Harris Group Notes the Sale of a Second D-Wave Quantum Computer May 16th, 2013

Nanometrics Announces Upcoming Investor Events May 14th, 2013

Nanostart-holding New Asia Investments invests in breakthrough water projects May 13th, 2013

Chip Technology

UC Riverside scientists discovering new uses for tiny carbon nanotubes: Adding ionic liquid to nanotube films could build smaller gadgets, and create more cost effective 'Smart Windows' that darken in bright sun May 15th, 2013

Nanometrics Announces Upcoming Investor Events May 14th, 2013

HELIOS Program Develops Complete Supply Chain for Integrating Photonics with CMOS Circuit via IC Fabrication Processes May 14th, 2013

Silex Microsystems Joins ENIAC Project PROMINENT To Bring Flexible and Cost Effective Inkjet Technologies to the MEMS Manufacturing Process: Silex Will Develop New Solutions for Through-Silicon Via Manufacture and Hermetic Wafer Bonding May 13th, 2013