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Home > News > Flip-chip methods adapted to nanotube fabrication

February 14th, 2006

Flip-chip methods adapted to nanotube fabrication

Abstract:
"What we are offering is a new paradigm for transferring and integrating carbon nanotubes onto integrated circuits and microelectronic packages," said Georgia Institute of Technology professor Ching-Ping Wong. "We have circumvented both the high-growth temperature and poor adhesion that currently plague other implementation methods."

Source:
EETimes

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