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Home > News > Futuristic interconnects for ICs proposed

July 18th, 2005

Futuristic interconnects for ICs proposed

Abstract:
At the IEEE International Interconnect Technology Conference (IITC), researchers presented several futuristic technologies to solve the interconnect bottleneck in chip design.

Activated bonding, air gap, carbon nanotubes, molecular wires, optical interconnects and spin-wave buses were among the technologies proposed at the event.

Source:
EETimes

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IEEE International Interconnect Technology Conference

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