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Abstract:
Novel conducting structures to be used in high-speed semiconductor packaging and metallic-based interconnect designs

SiliconPipe and Nano Cluster Devices Sign Agreement to Develop Products Using Nanotechnology to Enhance High-Speed Metallic Interconnect Performance

San Jose, CA | June 21, 2005

SiliconPipe, Inc., of San Jose and Nano Cluster Devices, Inc., have signed a Letter of Intent to jointly develop novel conducting structures to be used in high-speed semiconductor packaging and metallic-based interconnect designs.

"We have identified key application areas where we can use the methods developed by Nano Cluster Devices to create circuit elements from self-assembled atomic clusters which will significantly improve high-speed metallic circuit performance," said Kevin Grundy, CEO of SiliconPipe.

"The combination of SiliconPipe's electronic design expertise and atomic cluster deposition techniques from Nano Cluster Devices will enable the creation of unique structures that are impossible to create economically by other techniques," comments Dr. Simon Brown, Executive Director-Science and Technology for Nano Cluster Devices, Ltd.

"SiliconPipe is one of the most creative companies we know in the interconnect business," notes Dr. Alan Rae, VP of Market & Business Development at Nano Dynamics, Inc., "and they have already developed designs that have pushed the performance of high-speed interconnection to a point where their technology is competitive with optical methods. We feel confident that a combination of Nano Cluster Device’s technology and SiliconPipe’s will result in even higher performance and cost-effective packaging and based-based interconnect structures that will have widespread applications."

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About Nano Cluster Devices Ltd.:
Nano Cluster Devices Ltd was formed in early 2004 to commercialize a unique combination of top down and bottom up approaches to nano-technology. The key aspect of the technology is that nano-wires can be self-assembled between electrical contacts without the time consuming and expensive manipulation that typically hinders the production of nano-devices. Nano Cluster Devices, Inc., is a collaboration between Nano Cluster Devices Ltd. of Christchurch, New Zealand and Nano Dynamics, Inc., of Buffalo, New York.

Nano Cluster Devices Limited has developed novel methods for taking clusters of atoms and forming them into electrically conducting wires. These wires are so small they can only be seen with the aid of an electron microscope. They have a wide range of applications in many of the world’s multi-billion dollar industries. A comprehensive Patent Portfolio has been established.

For additional information about Nano Cluster Devices Ltd., visit www.nanoclusterdevices.com

About SiliconPipe:
SiliconPipe, founded in 2002 in San Jose, California, is an Open Source Intellectual Property Company that designs and integrates complete high-performance system-interconnect solutions. SiliconPipe’s suite of novel patent-pending Supercharged Copper technologies includes IC packaging solutions; low-skew parallel line interconnects for memories, AirCore™ cable, high-speed transceivers and high-performance copper backplanes. These technologies are significant improvements over traditional interconnect concepts and provide cost-effective solutions that meet the performance requirements of next-generation high-speed products. SiliconPipe has over 100 patent submittals.

For additional information about SiliconPipe, visit www.siliconpipe.com

Contact:
Bruce Schupp
Marketing Manager
SiliconPipe, Inc.
992 De Anza Blvd., Suite 201
San Jose, CA 95129
Telephone: (408) 973-1744 Ext. 209
Fax: (408) 973-8032

Dan Andersen
Director of Corporate Communications
dandersen@siliconpipe.com
650-348-0799

Nano Cluster Devices Ltd.
Nano Dynamics Inc.
Alan Rae
VP Market & Business Development

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