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May 17th, 2005
Like it or not, lead-free requirements and RoHS compliance are impending realities. While many companies have processes and products that meet these requirements right now, there are many reasons to be concerned about the use of lead-free solders. Conductive adhesives with nano-engineered fillers have shown some promise toward addressing those concerns. Much of this work is being done in the US by Professor C.P. Wong’s group at the Georgia Institute of Technology (Atlanta).
While some are busy developing nanotechnology for use in advanced sensors and post-CMOS ICs, it can also provide inexpensive solutions in packaging applications right now. With some luck, this fact could help to build nanotechnology infrastructure faster, so that it might be ready when we need it after CMOS runs out of steam.
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