Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > Press > Europe's IMEC to Use FEI's UltraView Tool Suite

Abstract:
UltraView Takes Manufacturers From Wafers to Atoms in Minutes While Keeping Production Wafers in the Fab

Europe's IMEC to Use FEI's UltraView(TM) Tool Suite in Process R&D Line

Hillsboro, OR | February 7, 2005

FEI Company (Nasdaq: FEIC) and IMEC, Europe's leading independent nano-electronics and nano-technology research center based in Leuven, Belgium, today announced that they have commenced a joint development project (JDP) for advanced metrology and analysis techniques for (sub)-45nm technologies.

The JDP will focus on providing ultra-high resolution process diagnostic information in a production environment in support of process development for 45nm and smaller technologies. IMEC will introduce a full suite of FEI's UltraView(TM) tools in its process R&D pilot line for these development efforts.

For the measurement of critical dimensions and analysis of layers and structures in the (sub)- 45 nm node, standard imaging and analysis methods will be no longer capable of providing sufficient information that chipmakers require to accurately analyze, predict and maximize yield and transistor performance. Metrology and chemical analysis with sub-nanometer resolution will be required to develop, ramp and produce these devices, while at the same time keeping to 18-24 month process development cycles. FEI's UltraView solution was designed to meet these challenges while also allowing product wafers to continue in the manufacturing process.

Ultraview gives access to site specific, sub-angstrom resolution for both metrology and chemical analysis of structures and layers both at the surface and subsurface, with fast time to result while preserving the wafer for further processing and analysis. UltraView makes use of FEI's most advanced tools for sample preparation and ultra-high resolution imaging and analysis, including FEI's in-fab Defect Analyzer(TM) 300 HP equipped with NanoLift(TM). Identified defects are rapidly milled and transferred to a sealed transfer capsule via a fully automated process. Wafers remain in the process flow as the sample, in its sealed environment, proceeds to the lab for thinning and advanced STEM and TEM analysis. Together, these tools deliver unmatched cost of ownership for next generation semiconductor fab processes.

About FEI Company:

FEI's Tools for Nanotech(TM), featuring focused ion- and electron-beam technologies, deliver 3D characterization, analysis and modification capabilities with resolution down to the sub-Angstrom level. With R&D centers in North America and Europe, and sales and service operations in more the 40 countries around the world, FEI is bringing the nanoscale within the grasp of leading researchers and manufacturers and helping to turn some of the biggest ideas of this century into reality. More information can be found on the FEI website at: www.feicompany.com.



Contact:
Dan Zenka, APR
Corporate Communications of FEI Company
+1-503-726-2695
dzenka@feico.com

Cathy van Mastrigt
Marketing Communications of FEI Company, Europe
+31-40-276.6225
cathy.van.mastrigt@feico.com

Copyright © FEI Company

If you have a comment, please Contact us.

Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Investments/IPO's/Splits

Harris & Harris Group Issues Its Financial Statements as of December 31, 2016, Posts Its Annual Shareholder Letter, And Will Host a Conference Call for Shareholders on Friday, March 17, 2017 March 15th, 2017

Harris & Harris Group Announces the Filing of Preliminary Proxy Materials Detailing Its Proposed Conversion From a BDC to a Registered Closed-End Fund January 24th, 2017

Harris & Harris Group Issues Reminder for Shareholder Update Call on January 10, 2017 January 10th, 2017

Arrowhead Provides Response to New Minority Shareholder Announcement January 7th, 2017

Chip Technology

A big leap toward tinier lines: Self-assembly technique could lead to long-awaited, simple method for making smaller microchip patterns March 27th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Argon is not the 'dope' for metallic hydrogen March 24th, 2017

Scientists discover new 'boat' form of promising semiconductor: GeSe Uncommon form attenuates semiconductor's band gap size March 23rd, 2017

Nanoelectronics

A big leap toward tinier lines: Self-assembly technique could lead to long-awaited, simple method for making smaller microchip patterns March 27th, 2017

Scientists discover new 'boat' form of promising semiconductor: GeSe Uncommon form attenuates semiconductor's band gap size March 23rd, 2017

UC researchers use gold coating to control luminescence of nanowires: University of Cincinnati physicists manipulate nanowire semiconductors in pursuit of making electronics smaller, faster and cheaper March 17th, 2017

A SOI wafer is a suitable substrate for gallium nitride crystals: Improved characteristics in power electronics and radio applications can be achieved by using a SOI wafer for gallium nitride growth March 4th, 2017

Announcements

Information storage with a nanoscale twist: Discovery of a novel rotational force inside magnetic vortices makes it easier to design ultrahigh capacity disk drives March 28th, 2017

ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22 FDX® Technology Platform: Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications March 27th, 2017

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Laser activated gold pyramids could deliver drugs, DNA into cells without harm: Microstructures create temporary pores in cells March 27th, 2017

Tools

“Cysteine Rose” Wins 2016 Thermo Fisher Scientific Electron Microscopy Image Contest: Thermo Fisher honors Andrea Jacassi of the Italian Institute of Technology for image of cysteine crystals using focused ion beam techniques March 27th, 2017

Leti and HORIBA Scientific to Host Webinar on Ultrafast Characterization Tool: Plasma Profiling Time-of-Flight Mass Spectrometer Tool Cuts Optimization Time In Layer Deposition and Fabrication of Wide Range of Applications March 27th, 2017

Researchers make flexible glass for tiny medical devices: Glass can bend over and over again on a nanoscale March 27th, 2017

Cryo-electron microscopy achieves unprecedented resolution using new computational methods March 25th, 2017

NanoNews-Digest
The latest news from around the world, FREE



  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project