- About Us
- Career Center
- Nano-Social Network
- Nano Consulting
- My Account
UltraView Takes Manufacturers From Wafers to Atoms in Minutes While Keeping Production Wafers in the Fab
FEI Company (Nasdaq: FEIC) and IMEC, Europe's leading independent nano-electronics and nano-technology research center based in Leuven, Belgium, today announced that they have commenced a joint development project (JDP) for advanced metrology and analysis techniques for (sub)-45nm technologies.
The JDP will focus on providing ultra-high resolution process diagnostic information in a production environment in support of process development for 45nm and smaller technologies. IMEC will introduce a full suite of FEI's UltraView(TM) tools in its process R&D pilot line for these development efforts.
For the measurement of critical dimensions and analysis of layers and structures in the (sub)- 45 nm node, standard imaging and analysis methods will be no longer capable of providing sufficient information that chipmakers require to accurately analyze, predict and maximize yield and transistor performance. Metrology and chemical analysis with sub-nanometer resolution will be required to develop, ramp and produce these devices, while at the same time keeping to 18-24 month process development cycles. FEI's UltraView solution was designed to meet these challenges while also allowing product wafers to continue in the manufacturing process.
Ultraview gives access to site specific, sub-angstrom resolution for both metrology and chemical analysis of structures and layers both at the surface and subsurface, with fast time to result while preserving the wafer for further processing and analysis. UltraView makes use of FEI's most advanced tools for sample preparation and ultra-high resolution imaging and analysis, including FEI's in-fab Defect Analyzer(TM) 300 HP equipped with NanoLift(TM). Identified defects are rapidly milled and transferred to a sealed transfer capsule via a fully automated process. Wafers remain in the process flow as the sample, in its sealed environment, proceeds to the lab for thinning and advanced STEM and TEM analysis. Together, these tools deliver unmatched cost of ownership for next generation semiconductor fab processes.
About FEI Company:
FEI's Tools for Nanotech(TM), featuring focused ion- and electron-beam technologies, deliver 3D characterization, analysis and modification capabilities with resolution down to the sub-Angstrom level. With R&D centers in North America and Europe, and sales and service operations in more the 40 countries around the world, FEI is bringing the nanoscale within the grasp of leading researchers and manufacturers and helping to turn some of the biggest ideas of this century into reality. More information can be found on the FEI website at: www.feicompany.com.
Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.
|Related News Press|
Harris & Harris Group Sponsors NYC American Heart Association's Health Sciences Innovation Investment Forum: Co-founder of Harris & Harris Group Portfolio Company TARA Biosystems to Speak About the Value of Tissue Engineering Technology April 21st, 2015
Long Island Capital Alliance Announces Participants for Brookhaven National Laboratory Technology Transfer Capital Forum on May 8: Keynote Speaker Dr. Doon Gibbs, Director of Brookhaven National Laboratory April 16th, 2015
Graphenea embarks on a new era April 16th, 2015
Drexel materials scientists putting a new spin on computing memory April 22nd, 2015
Printing Silicon on Paper, with Lasers April 21st, 2015
New class of 3D-printed aerogels improve energy storage April 22nd, 2015
Graphenea celebrates fifth anniversary April 27th, 2015
ORNL reports method that takes quantum sensing to new level April 23rd, 2015
Quantum 'paparazzi' film photons in the act of pairing up April 22nd, 2015
Richards-Kortum elected to American Academy of Arts and Sciences: April 22nd, 2015