Home > News > FEI Releases DualBeam Photomask Repair System for 65 nm Node
September 13th, 2004
FEI Releases DualBeam Photomask Repair System for 65 nm Node
Abstract:
FEI Company has released the industry's first-ever DualBeam(TM) mask repair system designed to repair photolithography mask defects for the 65 nm node. Combining both a focused ion beam (FIB) column and an environmental scanning electron microscope (ESEM(TM)) in a single system, the new Accura(TM) XT+ is a future-safe solution that can accommodate both today's photomasks and extend to a broad set of next-generation lithography technologies.
Source:
PRNewswire
Related News Press |
Chip Technology
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024
HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024
Announcements
NRL charters Navy’s quantum inertial navigation path to reduce drift April 5th, 2024
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
Tools
Ferroelectrically modulate the Fermi level of graphene oxide to enhance SERS response November 3rd, 2023
The USTC realizes In situ electron paramagnetic resonance spectroscopy using single nanodiamond sensors November 3rd, 2023
The latest news from around the world, FREE | ||
Premium Products | ||
Only the news you want to read!
Learn More |
||
Full-service, expert consulting
Learn More |
||