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Home > News > FEI Releases DualBeam Photomask Repair System for 65 nm Node

September 13th, 2004

FEI Releases DualBeam Photomask Repair System for 65 nm Node

Abstract:
FEI Company has released the industry's first-ever DualBeam(TM) mask repair system designed to repair photolithography mask defects for the 65 nm node. Combining both a focused ion beam (FIB) column and an environmental scanning electron microscope (ESEM(TM)) in a single system, the new Accura(TM) XT+ is a future-safe solution that can accommodate both today's photomasks and extend to a broad set of next-generation lithography technologies.

Source:
PRNewswire

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