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Home > News > Samsung mulls new 300-mm fab for 65-nm chips

August 26th, 2004

Samsung mulls new 300-mm fab for 65-nm chips

Continuing to expand its capacity, Korea's Samsung Electronics Co. Ltd. Wednesday (August 25) disclosed plans that it is looking to build a new wafer fab for use in processing devices at the 65-nm node. The proposed fab would be a 300-mm facility, which would make NAND-based flash memories and other 65-nm products. The company is already developing its first sub-70-nm parts, including an 8-gigabit flash-memory device for advanced NAND applications.


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