Home > News > Direct writing in three dimensions
August 16th, 2004
Direct writing in three dimensions
The ability to pattern materials in three dimensions is critical for several emerging technologies, including photonics, microfluidics, microelectromechanical systems, and biomaterials. Direct-write assembly allows one to design and rapidly fabricate materials in complex three-dimensional shapes without the need for expensive tooling, dies, or lithographic masks. Here, recent advances in ink and laser writing techniques are reviewed with an emphasis on the push toward finer feature sizes.
Next important step toward quantum computer: Scientists at the University of Bonn have succeeded in linking 2 different quantum systems March 30th, 2015
State-of-the-art online system unveiled to pinpoint metrology software accuracy March 27th, 2015
SUNY POLY CNSE to Host First Ever Northeast Semi Supply Conference (NESCO) Conference Will Connect New and Emerging Innovators in the Northeastern US and Canada with Industry Leaders and Strategic Investors to Discuss Future Growth Opportunities in NYS March 25th, 2015
NXP and GLOBALFOUNDRIES Announce Production of 40nm Embedded Non-Volatile Memory Technology: Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform March 24th, 2015