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Home > News > Renesas to expand 300-mm fab in 90-, 65-nm push

June 24th, 2004

Renesas to expand 300-mm fab in 90-, 65-nm push

In a move to keep up with current and future chip demand, Japan's Renesas Technology Corp. plans to more than double its production capacity within its 300-mm wafer fab over the next year. Renesas, the joint chip venture between Hitachi Ltd. and Mitsubishi Electric Corp., has also moved into 90-nm pilot production within its 300-mm fab unit in Japan, dubbed Trecenti Technologies Inc. Renesas is also accelerating its 65-nm process development, with plans to move the technology into volume production by 2006.


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