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Home > News > Phillip J. Bond to Deliver Address at Nanotechnology Conference

May 25th, 2004

Phillip J. Bond to Deliver Address at Nanotechnology Conference

Pennsylvania Community and Economic Development Secretary Dennis Yablonsky today announced that
Phillip J. Bond, Secretary of Commerce for Technology, U.S. Department of Commerce, will make remarks at "The Business of Nano" conference, which will be held May 25-26 at the Pennsylvania Convention Center in Philadelphia. The conference is designed to showcase innovative products, resources and programs
that are accelerating the adoption and application of nanotechnology throughout the state.


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