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Home > News > Thermal Insulation handles applications to 950░C

March 9th, 2004

Thermal Insulation handles applications to 950░C

Abstract:
MICROSIL Microporous Silica Thermal Insulation, with low-density construction of 230 kg/m│, minimizes conductive heat transfer. Billions of nano-pockets block convection and reflect heat energy back to source. Product combines silica powders, refractory oxides, and glass reinforcing agents and offers thermal conductivity of 0.038 W/mK at 800░C. Immune to thermal shock, non-combustible material is available in flat board form up to 2 in. thick and also as custom-machined products.

Source:
Industrial News Room

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