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Home > News > Materials for future electronics

March 4th, 2004

Materials for future electronics

Abstract:
The primary objective of DARPA’s Moletronics Program is to deliver a prototype 16 kbit nanocomputer memory by early 2005. This prototype will be integrated on the molecular scale and have dimensions of ~10 µm x 10 µm, which is approximately the footprint of a human cell. As a result, the target device density for the nanomemory is 100 Gbit/cm2. At this level of integration, the prototype will be ten times more dense than the dynamic random access memory (DRAM) that the Si industry projects it will deliver at the end of its roadmap in 2016. (PDF)

Source:
Materials Today

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