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Home > News > Breaking Into The Third Dimension Of Computer Chip Design

November 26th, 2003

Breaking Into The Third Dimension Of Computer Chip Design

Despite continuous technical advances in the semiconductor industry, microchips are still composed of laterally-arranged (side-by-side) transistors on a silicon substrate. EUREKA project E! 2259 VSI developed new ways to break through this two dimensional approach and the restrictions it imposes by designing 3-D chips or Vertical System Integration (VSI). This technology has immediate security benefits which are very desirable since chip cards often contain secure information or monetary values and, therefore, are subject to attack by hackers.

* AlphaGalileo

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