Home > News > Breaking Into The Third Dimension Of Computer Chip Design
November 26th, 2003
Breaking Into The Third Dimension Of Computer Chip Design
Despite continuous technical advances in the semiconductor industry, microchips are still composed of laterally-arranged (side-by-side) transistors on a silicon substrate. EUREKA project E! 2259 VSI developed new ways to break through this two dimensional approach and the restrictions it imposes by designing 3-D chips or Vertical System Integration (VSI). This technology has immediate security benefits which are very desirable since chip cards often contain secure information or monetary values and, therefore, are subject to attack by hackers.
Graphene chips are close to significant commercialization October 1st, 2014
Speed at its limits September 30th, 2014
Research mimics brain cells to boost memory power September 30th, 2014
'Pixel' engineered electronics have growth potential: Rice, Oak Ridge, Vanderbilt, Penn scientists lead creation of atom-scale semiconducting composites September 29th, 2014