Nanotechnology Now

Our NanoNews Digest Sponsors

Heifer International

Wikipedia Affiliate Button

Home > News > Breaking Into The Third Dimension Of Computer Chip Design

November 26th, 2003

Breaking Into The Third Dimension Of Computer Chip Design

Abstract:
Despite continuous technical advances in the semiconductor industry, microchips are still composed of laterally-arranged (side-by-side) transistors on a silicon substrate. EUREKA project E! 2259 VSI developed new ways to break through this two dimensional approach and the restrictions it imposes by designing 3-D chips or Vertical System Integration (VSI). This technology has immediate security benefits which are very desirable since chip cards often contain secure information or monetary values and, therefore, are subject to attack by hackers.

Source:
* AlphaGalileo

Bookmark:
Delicious Digg Newsvine Google Yahoo Reddit Magnoliacom Furl Facebook

Related News Press

Chip Technology

A nanoscale wireless communication system via plasmonic antennas: Greater control affords 'in-plane' transmission of waves at or near visible light August 27th, 2016

A promising route to the scalable production of highly crystalline graphene films August 26th, 2016

Analog DNA circuit does math in a test tube: DNA computers could one day be programmed to diagnose and treat disease August 25th, 2016

Silicon nanoparticles trained to juggle light: Research findings prove the capabilities of silicon nanoparticles for flexible data processing in optical communication systems August 25th, 2016

NanoNews-Digest
The latest news from around the world, FREE




  Premium Products
NanoNews-Custom
Only the news you want to read!
 Learn More
NanoTech-Transfer
University Technology Transfer & Patents
 Learn More
NanoStrategies
Full-service, expert consulting
 Learn More











ASP
Nanotechnology Now Featured Books




NNN

The Hunger Project







Car Brands
Buy website traffic