Home > News > X-ray inspection may meet computer chip-making need
November 21st, 2003
X-ray inspection may meet computer chip-making need
Abstract:
A decades-old, X-ray-based method for studying the atomic structure of materials may be the answer to a looming semiconductor industry need - a rugged, high-throughput technology for measuring dimensions of chip circuitry packed with devices approaching molecular proportions. A team led by NIST scientists recently reported* their initial success in adapting small-angle X-ray scattering (SAXS) to rapidly characterize the size and shape of grid-like patterns with nanometer-scale linewidths. With better than one nanometer precision, the team determined the average size of periodically repeating features arrayed on three chemically different samples much like the intricately patterned polymer masks used to print integrated-circuit designs.
Source:
EurekAlert
Related News Press |
Chip Technology
Discovery points path to flash-like memory for storing qubits: Rice find could hasten development of nonvolatile quantum memory April 5th, 2024
Utilizing palladium for addressing contact issues of buried oxide thin film transistors April 5th, 2024
HKUST researchers develop new integration technique for efficient coupling of III-V and silicon February 16th, 2024
Tools
Ferroelectrically modulate the Fermi level of graphene oxide to enhance SERS response November 3rd, 2023
The USTC realizes In situ electron paramagnetic resonance spectroscopy using single nanodiamond sensors November 3rd, 2023
The latest news from around the world, FREE | ||
Premium Products | ||
Only the news you want to read!
Learn More |
||
Full-service, expert consulting
Learn More |
||