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Home > News > Technology center to produce national packaging power

November 13th, 2003

Technology center to produce national packaging power

Abstract:
An alliance between Binghamton University, Rensselaer Polytechnic Institute, and the Infotonics Technology Center will help speed the commercialization of next-generation microsystems by focusing on electronics packaging research. Binghamton's Integrated Electronics Engineering Center will bring to the alliance its world-class expertise in mechanics, thermal management and reliability, said Bahgat Sammakia, interim vice president for research and director of the IEEC, a New York state Center for Advanced Technology.

Source:
SmallTimes

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