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Home > News > Infineon Demonstrates Shrinking of Barrier Films

May 27th, 2003

Infineon Demonstrates Shrinking of Barrier Films

Abstract:
Infineon Technologies AG today said that its Munich Research Labs have demonstrated, by shrinking present film thicknesses into nanotechnology geometries, that the requirements of thin encapsulation films in metallization schemes of future chip generations will be met.

Source:
Electronic News

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