Abstract:
FEI Company today announced that it has received multiple orders for its Certus 3D(TM), FEI's latest in-line DualBeam(TM) system designed to support new process nodes for the next generation of advanced thin-film heads. The Certus 3D was engineered with input from FEI's data storage customers as they prepared to transition to new process nodes requiring greater precision at feature sizes down to 40 nm.