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Electrochemical (EC) technologies attract constantly rising interest because it is the way for controlled modifications of the surface even with atomic precision.
June 5th, 2009
Electrochemistry at the nano-scale
Electrochemical (EC) technologies attract constantly rising interest because it is the way for controlled modifications of the surface even with atomic precision. EC deposition is a widely used approach for creation of thin metal films with unique properties. On the other hand EC dissolution allows imitation and study of corrosion processes. Scanning probe microscopy i.e. Atomic Force Microscopy (AFM) http://www.ntmdt.com/spm-principles/view/afm and Scanning Tunneling Microscopy (STM) http://www.ntmdt.com/spm-principles/view/stm-techniques techniques open up the possibility to monitor the nanometer scaled changes occurring at the surface during an EC modification. With the NTEGRA nanolaboratory http://www.ntmdt.com/platform/ntegra one can run various EC experiments in highly specialized conditions.
As an example the images (a-series) show that the external magnetic field (MF) strongly influences the Cu deposition process. Due to magneto-hydrodynamic (MHD) Electro-deposition Electro-deposition + convection and some other effects of interaction of ions with external MF the electrodeposition occurs much faster.